08/12/2016  A look at control of process uniformity across the wafer during plasma etch processes.

08/11/2016  Overall revenue for the power semiconductors market globally dropped slightly in 2015, due primarily to macroeconomic factors and application-specific issues.

08/10/2016  3-D laser lithography enhances microscope for studying nanostructures in biology and engineering/ publication in Applied Physics Letters.

08/10/2016  Europe's largest electronics manufacturing exhibition SEMICON Europa (25-27 October) will take place in Grenoble at ALPEXPO.

08/08/2016  To continue advancing, next-generation electronic devices must fully exploit the nanoscale, where materials span just billionths of a meter. But balancing complexity, precision, and manufacturing scalability on such fantastically small scales is inevitably difficult.

08/04/2016  Combined outlays from the “Big 3” spenders is forecast to almost double in 2H16 over 1H16.

08/02/2016  GLOBALFOUNDRIES announced that Wallace Pai has been appointed as vice president and general manager of China.

08/02/2016  Ultratech, Inc. today announced that it has received an 'Outstanding Supplier Award' from SJ Semiconductor Corp.

07/29/2016  The optics advancement may solve an approaching data bottleneck by helping to boost computing power and information transfer rates tenfold.

07/28/2016  The 2016 global semiconductor market is forecast to decrease by 2.4 percent from the previous year according to the World Semiconductor Trade Statistics (WSTS).

07/26/2016  University of Illinois researchers have developed a way to etch very tall, narrow finFETs, a type of transistor that forms a tall semiconductor "fin" for the current to travel over. The etching technique addresses many problems in trying to create 3-D devices, typically done now by stacking layers or carving out structures from a thicker semiconductor wafer.

07/22/2016  Worldwide semiconductor capital spending is projected to decline 0.7 percent in 2016, to $64.3 billion, according to Gartner, Inc. This is up from the estimated 2 percent decline in Gartner's previous quarterly forecast.

07/22/2016  Billings activity for equipment companies based in North America are at their highest level since February 2011.

07/21/2016  Paper-submission deadline is August 10 this year; Supplier exhibition to be held in conjunction with technical program.

07/21/2016  Final installment of biannual report outlines short-term and long-term challenges and opportunities facing semiconductor technology.

07/13/2016  Wenge Yang of Entegris spoke with the Show Daily about major trends in High Volume Manufacturing (HVM), and about the topics that will be discussed in the Entegris Yield Breakfast Forum “Yield Enhancement Challenges in Today’s Memory IC Production” happening Thursday morning, July 14.

07/13/2016  Fan-out wafer level packaging (FOWLP) is gaining traction, leading to higher I/Os and larger formats, and new mobile displays are pushing the limits of pixel per inch (PPI) while also moving to larger formats.

07/13/2016  Gear up for Day 2 of SEMICON West with this list of must-see conference events.

07/13/2016  Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.

07/12/2016  On Monday, imec – the Leuven Belgium-based research consortium – hosted its annual imec Technology Forum (ITF) USA, a half-day conference at the Marriott Marquis.