12/16/2013  SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, was named MEMS Supplier of the Year at the MEMS Executive Congress U.S. 2013 held in Napa last month

12/12/2013  Networks of nanometer-scale machines offer exciting potential applications in medicine, industry, environmental protection and defense, but until now there's been one very small problem: the limited capability of nanoscale antennas fabricated from traditional metallic components.

12/03/2013  Innovative design boosts the sensor's thermal and mechanical stability to deliver robust high performance in ultra space-saving footprint.

11/27/2013  CEA-Leti today announced a development agreement that will utilize Leti’s deep MEMS expertise and leading-edge infrastructure with OMRON, a global leader in factory automation and control solutions for the transportation, healthcare and consumer-goods industries.

11/26/2013 

11/26/2013 

11/25/2013  Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that its solution for 3-axis magnetometer plus 2-axis low g-test and calibration fully supports the technical features of today’s advanced 3D hall sensors.

11/21/2013  STMicroelectronics announced that it is launching its new ISO8200B, an innovative isolated power switch that enables smaller, more robust and energy-efficient controllers for industrial automation equipment.

11/21/2013  In September 2013, EPSON announced its next generation inkjet technology, PrecisionCore, introducing for the first time MEMS inkjet heads manufactured with thin film PZT technology. This announcement has been highly publicized: first, thin film PZT MEMS applications are now on the market, proving the reliability and maturity of this technology. Second, more inkjet head players will soon follow.

11/20/2013  SUSS MicroTec has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

11/15/2013  MEMS Industry Group (MIG)'s MEMS Executive Congress -- held November 7-8, 2013 in Napa, CA -- showed why the MEMS industry is outpacing the semiconductor industry, in both growth and innovation.

11/11/2013  STMicroelectronics has been selected by MEMS Industry Group and affiliated voters as the Company of the Year for its continuing success in growing its MEMS business, expanding its product line, and demonstrating industry leadership and vision.

11/05/2013  ‘Ecosystem for Nanotechnology, Entrepreneurship and Law’ (eNTEL) will provide unmatched student experience as launch pad for development of startup companies and attraction of business investment.

10/28/2013  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has delivered an EVG 6200 semi-automated mask alignment system to Micronit, a manufacturer of lab-on-a-chip products used in life sciences applications, such as molecular diagnostics and point-of-care, as well as micro-processed glass substrates for MEMS applications.

10/23/2013  Carlos Lee, Director General of the European Photonics Industry Consortium (EPIC), moderated a discussion with executives from the UK photonics industry and filed this report.

10/22/2013  A new Department of Energy grant will fund research to advance an additive manufacturing technique for fabricating three-dimensional (3D) nanoscale structures from a variety of materials. Using high-speed, thermally-energized jets to deliver both precursor materials and inert gas, the research will focus on dramatically accelerating growth, improving the purity and increasing the aspect ratio of the 3D structures.

10/17/2013  MEMS Technology Showcase will give MEMS Executive Congress US attendees an intimate look at some of the most unique and inspiring MEMS-enabled applications in the business. After a competitive application process, MEMS Industry Group (MIG) has selected five finalists that show how MEMS enhances the consumer experience, highlighting the “MEMS inside the machine.”

10/15/2013  At IEDM, IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.

10/15/2013  A research team in Japan has built a triangular InGaAs-on-insulator n-MOSFETs using MOVPE that has a high on-current of 930 µA/µm.

10/14/2013  Recent blogs address semiconductors in healthcare (blood cell sorters), FinFETs and logic roadmaps, 450mm progress, panel level embedded tech, materials innovation, options to reduce mask write time, SOI and EUV.