02/08/2012 

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.

02/08/2012 

Si-Ware Systems (SWS) launched a US subsidiary, Si-Ware Systems Inc. Scott Smyser, a new EVP for worldwide marketing and business development, will manage the US business.

02/08/2012 

JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.

02/03/2012 

Tokyo Electron Ltd. (TEL) restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments.

02/02/2012 

Qualtré, silicon MEMS inertial sensors developer, appointed Dr. Ijaz Jafri as VP of engineering, responsible for all aspects of product development and commercialization. Jafri has 16+ years of experience in MEMS and semiconductors.

02/01/2012 

Tessera Technologies Inc. (NASDAQ:TSRA) expects a mobile phone design win for its MEMS optical imaging technology in H1 2012, reported Robert A. Young, president and CEO.

01/30/2012 

Coventor Inc.'s CoventorWare 2012 MEMS design software offers full 64-bit support, a new hex-dominant extrude meshing capability, a new Python scripting interface for its enhanced suite of MEMS field solvers, and a new intuitive user interface.

01/30/2012 

Pure-play MEMS foundry Innovative Micro Technology (IMT) named Craig Ensley its president and CEO, joining the company with 30+ years of semiconductor and entrepreneurial experience.

01/27/2012 

Straight outta Purdue University, a miniaturized implantable medical micro electro mechanical (MEMS) pressure sensor chip can be recharged with the block-rockin beats -- acoustic waves -- of rap music.

01/25/2012 

Heidelberg Instruments launched the µPG 501 table-top direct-write lithography system for prototyping MEMS, integrated optics, microfluidic/lab-on-a-chip, and other devices as well as mask production.

01/24/2012 

Si-Ware Systems debuted the SiMOST platform to fab and package single-chip optical systems with validated MEMS components. Multiple MOEMS structures can be patterned and etched on SOI wafers using DRIE. The structures are then wafer-level packaged and diced.

01/24/2012 

01/23/2012 

Silex Microsystems joined Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices to develop TSVs, PZT thin films, and other technologies for high-performance RF systems targeting mobile devices.

01/20/2012 

MM, MEMS & NANO Live UK 2012 will take place at NEC Birmingham, UK, September 25-26, co-located with TCT Live, Mediplas, and Sensing Technology 2012.. Submit an abstract by February 28.

01/20/2012  Purdue University researchers have created microtweezers for the manufacture of tiny structures in MEMS, printing coatings on advanced sensors, and live stem cell sphere manipulation.

01/19/2012 

Sensors in Design 2012 takes place March 28-29 in San Jose, CA. With speakers from Texas Instruments and Intel, InvenSense, Analog Devices, and more, the event is designed for attendees to better understand sensor technologies and their applications.

01/19/2012 

Researchers at INCDTIM in Romania will use NanoInk's NanoFabrication Systems Division's DPN 5000 system for supramolecular structure fabrication, molecular recognition and self-assembling process applications.

01/18/2012 

36% of semiconductor fabs are in high-risk zones, finds Semico, noting the industry disruptions caused by the Japan earthquake and tsunami and Thai flooding and the challenges these presented to chip makers in the regions. 

01/10/2012 

The SMTA released its call for presenters for SMTA International (SMTAI) 2012, October 14-18 in Orlando, FL. The association, along with Chip Scale Review magazine, also announced the keynote for the International Wafer-level Packaging Conference (IWLPC), held November 5-8, San Jose, CA.

01/04/2012 

Embedded features and sensor integration will determine the future applications of MEMS sensors. Jay Esfandyari et al, STMicroelectronics, share an overview of future trends of sensor integration -- sensor fusion -- and some of the features available today in digital MEMS inertial sensors.