09/08/2017  UPMEM, a fabless semiconductor startup company, announces UPMEM Processing In-Memory (PIM), the next generation hardware solution for data intensive applications in the datacenter, solving server-level efficiency and performance bottlenecks.

08/31/2017  STMicroelectronics has strengthened its ecosystem through a Partner Program that connects customers with qualified technical specialists capable of strategically supporting their projects.

08/29/2017  Five companies compete for attendee votes at SEMI European MEMS & Sensors Summit, September 20-22, 2017, Grenoble, France.

08/29/2017  Despite its age and maturity, the automotive market has witnessed many unexpected developments over the past two years. And as has always been the case, safety drives the market.

08/29/2017  Unlike the slow ferroelastic domain switching expected for ceramics, high-speed sub-microsecond ferroelastic domain switching and simultaneous lattice deformation are directly observed for the Pb(Zr0.4Ti0.6)O3 thin films. This exciting finding paves the way for high-frequency ultrafast electromechanical switches and sensors.

08/22/2017  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it will partner with Rambus to make Rambus cryptography technology available for the SiFive Freedom platforms.

08/22/2017  MRSI Systems is launching a new High Speed Die Bonder, MRSI-HVM3, to support photonics customers’ high volume manufacturing requirements.

08/09/2017  NanoString Technologies, Inc. and Lam Research Corporation today announced a strategic collaboration to develop NanoString's proprietary Hyb & Seq next-generation sequencing platform.

08/08/2017  The combination of Intel and Mobileye will allow Mobileye's computer vision expertise (the "eyes") to complement Intel's high-performance computing and connectivity expertise (the "brains") to create automated driving solutions from cloud to car.

07/24/2017  Novel method of propagating spin waves could pave the way for high-speed, miniaturized data processing devices.

07/13/2017  Digital disruption begets innovation. Challenges equal opportunities.

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.

06/20/2017  ULVAC Technologies, Inc., a supplier of production systems, instrumentation and vacuum pumps for technology industries, has opened an office in Santa Clara, California.

06/16/2017  With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.

05/25/2017  OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market.

05/22/2017  Strong unit growth continues to be driven by the spread of automated embedded controls, wearable systems, and the Internet of Things, says new O-S-D Report.

05/22/2017  Demand for EVG wafer bonding solutions driven by accelerated production ramp in advanced packaging, advanced MEMS devices and CMOS image sensors.

05/12/2017  Racyics GmbH announced today it has launched makeChip, an design service platform, developed using GLOBALFOUNDRIES' 22FDX process technology and supported by Cadence.

04/21/2017  Widely used microscopy technique has unintended consequences, new Oxford University research reveals.

04/21/2017  North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in March 2017, according to the March Equipment Market Data Subscription Billings Report published today by SEMI.