10/12/2012 

Many early-stage tool development projects lack focus in what is needed for tool functionality and performance. Nevertheless, a disciplined phased approach to can resolve many open issues (technical, commercial and market-related) in the first phase of any project.

10/08/2012 

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”

10/05/2012 

Tessera Technologies is giving CEO Robert A. Young a big financial incentive to spin off one of its two businesses by March 2015, one of the company's key long-term strategic goals.

10/04/2012 

Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.

10/04/2012 

Applied Materials says it will reduce its work force by between 6% and 9% (900-1300 positions) amid a global realignment deemed necessary to achieve certain strategic objectives, freeing up to $190M annually "to fund key growth initiatives."

10/03/2012 

Even though semiconductor manufacturers in Japan are consolidating and transitioning to a "fab-lite" strategy,  the region still represents a large installed fab capacity and a major market for equipment and materials suppliers.

09/26/2012 

EV Group says it has received an order for its EVG850 temporary bonding/debonding systems from a leading maker of compound semiconductor-based components, what it says is the first use of its ZoneBOND technology in this area.

09/21/2012 

Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.

09/19/2012 

SPTS' Delta fxP cluster system achieves low-temperature deposition of TEOS oxides and nitrides for via-reveal passivation in 3D IC packaging, solving two key problems of low temperatures and bonding adhesive outgassing.

09/18/2012 

At IEDM, IBM researchers will demonstrate high-performance state-of-the-art CMOS circuits —including SRAM memory and ring oscillators—on a flexible plastic substrate.

09/17/2012 

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.

09/14/2012 

Singapore’s A*STAR’s Institute of Microelectronics (IME), and Hitachi Chemical Co., will be collaborating on a joint research program to develop high performance material technologies for thin wafer processing for 3D IC packaging.

09/10/2012 

EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).

09/04/2012 

Ultra Tec Manufacturing has released a new endpoint detection module for its ASAP-1 IPS selected area preparation system, for improving electronic package decapsulation and sample preparation.

09/04/2012 

Wafer probe card maker FormFactor has agreed to acquire fellow probe card supplier MicroProbe, with a combined entity rivaling top-seller Micronics in the high-growth probe card market.

08/31/2012 

Bruker said that a leading semiconductor supplier purchased multiple ContourGT-X 3D optical microscope systems for its packaging factories in Asia and North America to support copper wire bond inspection and process control needs. 

08/31/2012 

Kulicke & Soffa Industries, Inc. launched its next generation manual wire bonder series, the iBond5000.  The series, which is based on the company’s 4500 line, includes ball, wedge and dual-capability bonding options.

08/28/2012 

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders.

08/28/2012 

Brian Cronquist, MonolithIC 3D Inc.'s VP of Technology and IP reports on recent progress on low temperature (less than 400°C) bonding and cleaving processes.

08/24/2012 

The US SEC adopted a rule that requires companies to publicly disclose their use of conflict minerals -- including tantalum, tin, gold, and tungsten -- that originated in the Democratic Republic of the Congo (DRC) or an adjoining country.