10/18/2017  The annual revenue from the global IC testing and packaging industry for 2017 is estimated to grow by 2.2% to reach US$51.73 billion, according to the latest research from TrendForce.

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

10/11/2017  TMC will invest approximately 110 billion yen as a second investment in Fab 6 for the installation of additional manufacturing equipment in the Phase-1 clean room.

10/10/2017  The global CMOS image sensor market is expected to grow at a CAGR of more than 12% during the forecast period, according to Technavio’s latest market research.

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.

09/06/2017  Slated for September 18-20 in San Jose, Calif., the 18th annual SMC “offers a unique chance to network and discover opportunities in and around the industry in a year where dramatic growth has returned to the semiconductor market,” observes SMC 2017 co-chair Mark Thirsk of Linx Consulting, who will provide opening remarks at the conference.

09/01/2017  A dozen performer teams with DARPA’s CHIPS program convene to kick off an ambitious push for an era of versatile, plug-and-play "chiplets."

07/26/2017  Issued every two years, Bosch’s coveted awards recognize companies that have demonstrated outstanding performance in the manufacture and supply of products or services to Bosch.

07/26/2017  Through the first half of the year, 2017 equipment billings are 50 percent above the same period last year.

07/21/2017  Atlas 0.3 mm pitch spring probe validated at customer site.

07/14/2017  Leti today announced that the European FP7 project PLAT4M has now been completed with results that exceeded expectations.

07/13/2017  Digital disruption begets innovation. Challenges equal opportunities.

07/10/2017  A new low-temperature solution printing technique allows fabrication of high-efficiency perovskite solar cells with large crystals intended to minimize current-robbing grain boundaries.

06/29/2017  Twelve years of continuous operation amounts to over 18.9 billion rotations.

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.

06/16/2017  With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.

06/15/2017  The need for ever more computational power continues to grow and exaflop (1018 ) capabilities may soon become necessary.

06/15/2017  Yole Developpement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth between 2016 and 2022: +7% in revenue.

06/08/2017  AI is driving the development of 3D TSV and heterogeneous integration technologies.

06/05/2017  Mentor, a Siemens business, today announced that it has launched the Mentor OSAT (outsourced assembly and test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer integrated circuit (IC) designs.