Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES


Hesse & Knipps opens wedge bonder demo lab on West Coast

02/15/2012 

Backend packaging equipment supplier Hesse & Knipps Inc. opened a West Coast Demo and Applications Laboratory at its manufacturer rep Chalman Technologies.
LEDs, power semiconductors packaged with high-thermal-conductivity die attach adhesives

02/15/2012 

Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.
Theta Delta's burn-in & long-term semiconductor testers gain Core Wafer Systems technologies

02/09/2012 

Theta Delta will incorporate Core Wafer Systems technologies into its burn-in test and long-term reliability test systems for semiconductors. Core Wafer Systems provides parallel measurement schema for semiconductor test.
Synova Laser MicroJet wafer dicing tools to be made by Makino

02/09/2012 

Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology.
SATS providers order BTU reflow ovens in Asia

02/08/2012 

BTU International Inc. won multiple orders for PYRAMAX solder reflow ovens from semiconductor assembly and test subcontractors (SATS) in Asia.
Rudolph sells metrology tool for back-end wafer packaging processes

02/06/2012 

Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.
SUSS wafer bonder/debonder features up to 6 modules in new generation

02/06/2012 

SUSS MicroTec launched the XBC300 Gen2 high-volume 3D wafer processing tool for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers.
3M debuts high-capacitance ECM for IC packaging, RF, other apps

02/02/2012 

3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).
Multitest launches MT9510 x16 test tool with Asian sale

02/01/2012 

Multitest launched its tri-temp 16-site pick-and-place platform, MT9510 x16, with an installation at a high-volume chip test site in Asia.
Tanaka establishes copper bonding wire production in Taiwan

01/31/2012 

Tanaka Denshi Kogyo K.K., of Tanaka Precious Metals, will establish a production subsidiary for manufacturing copper bonding wire in Taiwan, with manufacturing ramp on February 1.
Keithley Instruments upgrades semiconductor test software suite

01/26/2012 

Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with several Keithley instrument and system configurations for automated device characterization and reliability analysis.
BSE Group achieves milestones in semiconductor equipment financing biz

01/26/2012 

Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Semi Equipment's fab equipment leasing business also received a $100M annual commitment from its financial backer, Wafra Capital Partners.
3D MID sensor fabricated with Ticona laser-activated LCP circuits

01/25/2012 

2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.
Presto Engineering semiconductor service hub opens in Israel

01/24/2012 

Presto Engineering, integrated semiconductor test and product engineering services provider, opened its newest Hub to serve the semiconductor design community, in Israel.
CWS upgrades on-wafer accelerated reliability line for Agilent testers

01/24/2012 

Core Wafer Systems, subsidiary of Action Products International, upgraded its PDQ-WLR on-wafer accelerated reliability product line to version 7.0, designed specifically for Agilent Technologies' Parametric Testers.
Silex devs wafer-level MEMS fab technologies for mobile devices

01/23/2012 

Silex Microsystems joined Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices to develop TSVs, PZT thin films, and other technologies for high-performance RF systems targeting mobile devices.
Hitachi Chemical claims die bonding film patent violation

01/19/2012 

Hitachi Chemical filed a lawsuit against INNOX in Taiwan, alleging infringement on Hitachi Chemical's Taiwanese patent related to die bonding film used in semiconductor packaging processes.
Optomec expands aerosol jet lab for 3D semiconductor packaging, PV, other device formation

01/19/2012 

Optomec opened its new and expanded Advanced Applications Lab and Product Development Facility in St. Paul, MN. The facility will help Optomec grow its Aerosol Jet additive manufacturing technology for advanced printed electronics applications.
Anti-counterfeiting program uses DNA to uniquely code computer chips

01/18/2012 

The College of Nanoscale Science and Engineering (CNSE) and Applied DNA Sciences (APDN) are partnering to prevent the counterfeiting of computer chips.
Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop

01/18/2012 

Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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