12/09/2011 

STATS ChipPAC says its Thai operation hit by flooding will remain offline through January, longer than anticipated. And one analyst puts a number to the total disaster's industrywide impact: 3.8 million fewer PC units in the pipeline for 1Q11.

12/09/2011 

Kulicke & Soffa Industries Inc. (NASDAQ:KLIC or K&S) named Chin Hu Lim to its Board of Directors, also serving on KLIC's Management Development & Compensation Committee.

12/06/2011 

SEMI projects that worldwide sales of new semiconductor manufacturing equipment will reach $41.8  billion in 2011, decline in 2012, and rebound again in 2013. Front-end equipment experienced an increase in sales this year, while back-end tools saw a decrease.

12/06/2011 

Tokyo Electron Limited (TEL) launched a suite of 3D packaging tools: the Tactras FAVIAS TSV deep-silicon etch system; the TELINDY PLUS VDP film deposition tool; and the wafer bonder/debonder Synapse Series.

12/06/2011 

Tokyo Electron Limited (TEL) has successfully demonstrated dynamicing -- device switching/dynamic characteristic (AC) -- of a power device at the wafer level.

12/05/2011 

Technic Inc. is entering the last development phase on technologies to reduce gold consumption in electronics packaging and connector applications, a product group it will call "Goldeneye."

12/05/2011 

SUSS MicroTec launched the XBS300 temporary bonder for high-volume wafer manufacturing. The Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications as well as other processes that require thin wafer handling.

12/05/2011 

EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool functionality. The platform will be used for all high-volume manufacturing tool offerings.

12/05/2011 

Applied Materials Inc. (AMAT) launched the Applied Producer Optiva chemical vapor deposition (CVD) system for back-side-illuminated (BSI) image sensor manufacturing. It deposits low-temperature conformal films that boost the low-light performance of the sensor while improving its durability.

12/05/2011 

Brewer Science Inc. will offer the ZoneBOND process on equipment supplier SUSS MicroTec's XBC300 and XBS300 wafer bonding platforms.

12/01/2011 

International Rectifier (IR) purchased multiple Apollo physical vapor deposition (PVD) systems from packaging equipment maker NEXX Systems for its Newport, Wales fab.

11/29/2011 

Dainippon Screen Mfg. Co. Ltd. developed the DW-3000 direct imaging exposure system for next-generation semiconductor packaging, exposing complex 3D multilayer substrates while adjusting for warping and distortion of individual wafers.

11/29/2011 

Applied Materials released a new film treatment, Applied Producer Onyx, that reduces the power consumption in semiconductor chips while increasing mechanical strength. The product targets the challenges associated with 3D packaging applications and technologies.

11/25/2011 

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces the cooperation with Swansea University´s Centre for NanoHealth (CNH).

11/23/2011 

Citing rising demand and a potential industry shortage, NeoPhotonics is in the process of more than doubling its production capacity of narrow linewidth tunable lasers with minimal expected additional capital expenditures.

11/22/2011 

Paul Feeney, director of process technology at Axus and ITRS co-leader for planarization topics, reports from the International Conference on Planarization/CMP Technology in Korea. Technical themes continue to address main areas (STI, ULK) but also explore new applications (e.g. TSVs), non-uniformity, and interaction between all the CMP process components.

11/16/2011 

Fan-out wafer-level packaging (FO-WLP) is gaining momentum as an option for devices with large numbers of I/Os, vs. going finer-pitch to keep using conventional fan-in technology, says TechSearch International in an updated report.

11/16/2011 

Precision Mechatronics Pty Ltd acquired Surfx Technologies, which specializes in high-speed atmospheric plasma technology for MEMS, microfluidics, semiconductors, solar cells, medical devices, and other manufacturing.

11/15/2011 

Applied Materials Inc. (Nasdaq:AMAT) presented five companies with awards for helping Applied meet its strategic business goals in 2011.

11/14/2011 

Microsemi SoC Products Group will use outsourced semiconductor assembly and test (OSAT) provider Amkor Philippines (ATP) for final electrical package test on nearly all its products.