Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Graphene nanoribbons form from H-unzipped CNT

05/11/2011 

Researchers unzipped single-walled carbon nanotubes by using a reaction with molecular hydrogen.An international research team, led by Umeå University's Alexandr Talyzin, has discovered a method to unzip carbon nanotubes with hydrogen, creating graphene nanoribbons and graphane. Nanoribbons produced by the new method will have hydrogen on the edges, which can be an advantage for some applications.

Day 2, 3 talks on process integration, reliability, 3Di

05/11/2011 

John Iacoponi, IITC 2011 co-chair, reviews Day 2-3 discussions at IITC/MAM, including interconnect reliability, BEOL memory, 3D integration, process integration, ultralow-k, and future-looking talks on graphene and carbon nanotubes.

RFaxis' pure-CMOS on-die coexistence filter reduces package size, current consumption

05/10/2011 

RFaxis released its patent-pending On-Die Coexistence Filter technology, designed to replace "bulky and expensive" stand-alone coexistence filters for cellular, mobile, and other devices.

Nano and advanced materials R&D at Clarkson U

05/09/2011 

Clarkson researchers videosPeter Singer recently toured the Center for Advanced Materials Processing (CAMP) at Clarkson University. The following video interviews with researchers and professors cover particle transport, chemical-mechanical planarization (CMP), cleanroom technologies, and bright nano particles, among other topics.

Nanotech, novel design help bring about stacked sensors: Research update

05/09/2011 

Figure. Single sensor modules can be stacked to create a sensor system via standardized interfaces.The research project "MANOS" combines innovative surface coatings based on nanoparticles and the latest adhesive procedures for new embedding technologies and novel circuit-board-based modular fasten and release technology used to stack sensor systems.

Pyrograf CNT production ISO 9001 certified

05/09/2011 

Pyrograf Products Inc.'s quality management system has been ISO 9001:2008 certified. In the growing field of carbon nanotube (CNT) manufacturers, ISO certification provides essential customer confidence and company credibility, states Pyrograf Products.

TSVs, beyond-CMOS top IITC-MAM "must see" lists for conference chairs

05/04/2011 

Cross-sectional TEM images of metal caps on 66nm wide Cu lines for three different processes: a) process A with 5nm-thick and full coverage; b) process B with <3nm-thick and partial coverage; c) process C with 8nm-thick and partial coverage; and d) a dark-field image along with the line direction with the metal cap "A."Three chairs of IITC-MAM, opening next week in Germany, share details on papers attendees won't want to miss. Among the hot-button technologies are through silicon via (TSV) integration, RC performance, carbon interconnects, and pushing traditional technologies farther (think lithography).

Phase change conductivity control could lead to "automatic" fuses

05/04/2011 

Image. An artistic rendering of the suspension as it freezes shows graphite flakes clumping together to form a connected network (dark spiky shapes at center), as they are pushed into place by the crystals that form as the liquid hexadecane surrounding them begins to freeze. SOURCE: Jonathan Tong.A team of researchers at MIT has found a way to manipulate both the thermal and electrical conductivity of materials by changing the external conditions. The technique can change electrical conductivity by factors of well over 100, and heat conductivity by more than threefold.

STATS ChipPAC invests in copper wire bonding for 45nm, low-k

05/04/2011 

STATS ChipPAC Ltd. (SGX-ST: STATSChP), semiconductor test and advanced packaging service provider, has shipped over 300 million semiconductor packages with copper wire-bond interconnects. The SATS provider is investing in Cu wire bonding for finer silicon nodes (45/40nm) and low-k/extra low-k.

MRS Day 5: Opto, interconnects, organics, Borg?

05/03/2011 

Michael A. Fury concludes his series of reports from this year's MRS Spring meeting. Highlights from Day 5: lots of papers targeting optoelectronics and interconnects with graphene and nanotubes, lots of work in organic materials and devices, and several pathways for technologies in life science applications.

MRS Day 4: Outside CMOS fabrication, but respecting boundaries

04/29/2011 

Michael A. Fury continues reporting from this year's MRS Spring meeting. Highlights from Day 4: NEMS and MEMS devices, organic electronics, deposition (ALD, CVD, and ED), and measuring stresses in Cu TSV.

SEMI's Stan Myers will retire in 2011

04/28/2011 

President and CEO Stanley T. Myers has informed the SEMI International Board of Directors of his intention to step back from executive leadership of SEMI this year. An executive search team will immediately begin looking for his successor.

Semiconductor materials group prez joins JSR Corp's Officers Committee

04/28/2011 

Tokyo-based JSR Corporation named the first non-Japanese Officer to its Officers Committee. Eric R. Johnson, the current president of the company's US semiconductor materials operations, JSR Micro, has been named as an Officer.

Imec CNT research: IITC preview

04/25/2011 

after barrier deposition and Cu fillImec researchers will present "Carbon nanotube interconnects: electrical characterization of 150nm CNT contacts with Cu damascene top contact" at IITC 2011. Dr. Marleen van der Veen, senior research scientist at imec discussed the research results and their significance.

Tool demand still high, amid a backend-frontend breakup

04/25/2011 

As SEMI's numbers for semiconductor manufacturing equipment climbed again in March, one slice of the data suggests that the backend-as-leading-cyclical-indicator wisdom we've been taught to follow may not be valid this time around.

Novel nanomaterials search funded by Army Research Lab

04/25/2011 

A University of Arkansas physicist has received the largest award granted to an individual researcher from the Army Research Laboratory to search for a novel class of nanomaterials with rationally designed properties.

Chip tool demand up, billings down: March book-to-bill pushes toward parity

04/23/2011 

North America-based manufacturers of semiconductor equipment posted $1.70 billion in orders in March 2011 and a book-to-bill ratio of 0.95, according to the March Book-to-Bill Report published by SEMI.

Laird phase change material enables stencil applied TIM

04/23/2011 

Laird Technologies released the Tpcm 580SP Series phase change material, a high-performance, screen-printable or stencilable thermal interface material with a thermal conductivity of 4.0W/mK that provides an alternative to thermal grease.

Intel honors 28 top suppliers, "achievers"

04/20/2011 

Twenty-eight companies get the nod from Intel's latest supplier awards, including four "Achievement" award winners.

SmartKem wins investments for flex printed electronics development

04/20/2011 

SmartKem Limited, developer of novel, printable organic semiconductor materials and ink formulations for flexible electronics, received investment funding from the Porton Capital Group and Finance Wales Investments Limited.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts