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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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Agilent Technologies Inc. (NYSE:A) delivered a fully integrated 1.1-THz network analysis measurement solution to Japan's Yamaguchi University. The solution will play a critical role in enabling the university to study metamaterials at THz frequencies.
Researchers at Eindhoven University of Technology have developed a replacement for indium tin oxide (ITO). This transparent, conducting film is produced in water, and based on electrically conducting carbon nanotubes (CNT) and plastic nanoparticles. The film currently provides a factor 100 lower conductivity than ITO, but this could rapidly change.
Electron microscopes combined with a gas-injection system were used by Empa and EPFL researchers to write nanometer-wide surface structures, "flat gratings," to improve VCSEL lasers.
Questar Products International released the Q7000 series of fine-pitch, fine-wire (17-75μm), aluminum/gold (Al/Au) automatic wedge and ball bonders to better meet smaller lot size, multiple product variation, frequent set-up change styles of package production.
Zymet Inc. introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. The adhesive can prevent pad damage during BGA rework, particularly with fine-pitch BGAs.
University of Illinois researchers found that graphene transistors have a nanoscale thermoelectric cooling effect that can be stronger at graphene contacts than resistive heating, lowering the temperature of the transistor.
Scientists at the National Institute of Standards and Technology (NIST) have developed a way to measure the wear and degradation of the microscopic probes used to study nanoscale structures in situ and as it's happening. NIST materials engineer Jason Killgore measures the resonant frequency of the AFM sensor tip, a natural vibration rate.
Daniel Duffy, research scientist in Henkel's Advanced Technology Group, notes pros and cons of epoxy and silicone encapsulants for high-brightness LED (HB-LED) manufacturing, and what HB-LED manufacturers need from die attach materials. He also considers quantum dots.
Sigurd Microelectronics Corporation (Sigurd) will be the first adopter of Multitest's MT2168 pick-and-place test handler in volume production in Taiwan. The SATS provider will use it to test various QFN packages.