Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Nano-engineers-grow-tissues-with-functional-blood vessels at UCSD

11/17/2010 

nanoscaffolding for blood vesselsUniversity of California, San Diego NanoEngineers won a grant from the National Institutes of Health (NIH) to develop the tools to manufacture biodegradable frames around which heart tissues -- functional blood vessels included -- will grow.

Limit-carbon-nanotube-CNT-exposure, warns UC Berkeley, NSF research

11/17/2010 

While offering great promise in a host of new applications, carbon nanotubes (CNTs) could be harmful to humans and a new risk review suggests product designers and others should provisionally treat CNTs "as if" they are hazardous.

Imaging-tool-screens-CNTs-transient-absorption

11/16/2010 

Semiconducting and metallic carbon nanotubes (CNTs)Metallic and semiconducting single-wall carbon nanotubes (SWCNT) can be distinguished using a new imaging tool for rapidly screening the structures, researched at the Weldon School of Biomedical Engineering, Purdue University.

Packaging-providers-growing-faster-than-semiconductor-market-Gartner-forecast

11/12/2010 

Packaging providers outgrowing semiconductor fab market: Gartner forecastJim Walker, research VP at Gartner, told attendees at the Gartner Semiconductor Briefing (11/4/10, San Jose, CA) that, after declining 14.7% in 2009, the outsourced semiconductor assembly and test services (OSATS) market will expand by 37% this year, and by 6.2% in 2011.

How strain can protect devices from ESD: IEDM Preview

11/11/2010 

The use of strain engineering can have a positive impact on a device's robustness to electrostatic discharge (ESD). At the upcoming IEDM event, researchers from the US and Europe will discuss the impact of strain on different ESD protection devices in bulk silicon and SOI.

Bond-align-mask-align-SUSS-MicroTec-Fraunhofer-collab

11/11/2010 

SUSS MicroTec and Fraunhofer for Surface Engineering and Thin Films IST launched SELECT, a technology for bond aligners and mask aligners that selectively activates parts of wafer surfaces through plasma.

ADA-to-improve-thermal-interface-materials-with-CNTs

11/09/2010 

ADA Technologies, Inc. received a $100,000 contract from the U.S. Air Force for Phase I research into the development of improved thermal interface materials (TIM) for use in microchips.

Kulicke-Soffa-pushes-copper-wire-bonding-transition with IConnPS ProCu

11/09/2010 

Kulicke & Soffa Industries Inc. (Nasdaq: KLIC) introduced the IConnPS ProCu wire bonder optimized for copper wire bonding. The K&S IConnPS ProCu offers a significant and new level of capability for packaging lines transitioning from gold to copper wire bonding.

Copper-wire-bonding-consortium-Freescale-GLOBALFOUNDRIES-UNISEM-and-more

11/09/2010 

The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, launched the Copper Wire (Cu-Wire) Bonding Consortium. The consortium will tackle existing Cu-Wire bonding issues of quality and reliability, and improve existing measurement systems.

Dow-Electronic-Materials-opening-TMG-facility-in-Korea

11/05/2010 

Dow Electronic Materials has broken ground for a new metalorganic precursor manufacturing plant in Cheonan, Korea. Dow is expanding TrimethylGallium (TMG) production capacity to meet the surging global demand for the material in the LED and related electronics markets.

Smart textile large-area manufacturability at heart of PASTA project

11/03/2010 

imec PASTA smart textile project aimsBare die in yarn, comfortable electronics, stretchable interposers, washable photovoltaic clothes, and other elements will be on the table for the PASTA project to bring smart textiles from the lab to industrial manufacturability. Imec leads the program.

Graphene-oxide-could-revolutionize-electron-microscopes

11/02/2010 

Graphene oxide's pivoting hooks could revolutionize work of electron microscopesA team of University of Warwick researchers has found molecular hooks on the surface of graphene oxide that will potentially provide massive benefits to researchers using transmission electron microscopes (TEM). They could even be used in building molecular-scale mechanisms.

New EI LCP laminates meet harsh environment SiP reqs

11/02/2010 

EI added LCP Laminates to its family of microelectronics packaging product offerings. Custom-designed LCP Laminates are suitable for semiconductor packages as LCP coreless designs for up to 6 layers as well as in combination with other rigid materials as hybrid circuits. Development and testing of Z-interconnect cross-sections for >8 layer offerings are also underway.  

Momentive-thermal-management-materials-LEDs

11/01/2010 

To increase the performance and service life of LEDs and LED assemblies, Momentive Performance Materials introduced a line of thermally conductive silicones to be considered for use in LED manufacturing and assembly.

OEM-level offsite outsourcing: a new paradigm

11/01/2010  Robert de Neve, E Systems Technology, Mountain View, CA USA

Ion-implant-debut-VSEA-sub30nm-semiconductor-fab

10/29/2010 

The VIISta Trident high-current ion implanter from Varian Semiconductor Equipment Associates Inc. (NASDAQ: VSEA) enables high-performance, low-leakage devices while improving productivity at the sub30nm wafer fab node.

LED-industry-LED-manufacturing-tech-report due out from Yole, EPIC

10/27/2010 

The packaged LED market is experiencing tremendous growth with an expected CAGR of 28.2% between 2009 and 2015. Yole and EPIC will publish their new market & technological studies dedicated to LED market and manufacturing technologies in November.

Nanoplas targets 200mm MEMS and 3D TSV packaging with dry processing tool

10/26/2010 

Nanoplas toolNanoplas introduced a fully automatic dry-processing batch system for high-volume 200mm production. The DSB 9000A is based on Nanoplas’s High Density Radical Flux (HDRF) technology.

September slide: Welcome to the semicap equipment downturn?

10/22/2010 

SEMI's August numbers indicated the possible beginnings of a peak in equipment demand -- and the September numbers sure like a pullback, with orders declining -11% in a quarter-closing month.

NASA_technologist_talks_CNT_nanowires_PCMs, and commercialization of nanotechnology

10/21/2010 

NASA technologist talks CNTs, nanowires, PCMs, and commercialization of nanotechnologyDr. Meyya Meyyappan, chief scientist for exploration technology at the Center for Nanotechnology at NASA Ames Research Center, discussed his group’s research in carbon nanotubes (CNTs), nanowires, and phase-change memories (PCM), as well as a next-generation non-volatile resistive switching memory.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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