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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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SET unveiled a patented system enabling a thorough removal of oxides before or during the semiconductor packaging bonding sequence. Addressing the challenges of the oxidation of metal surfaces in device bonding, this machine system encompasses a substrate chuck and a bond head with a non-contact localized confinement chamber that operates safely with reducing gases such as forming gas or formic acid vapor.
AMO GmbH and SUSS MicroTec AG are developing applications for substrate conformal imprint lithography (SCIL) with UV curing material. Due to unique sequential contacting and separation technology, a distortion-free replication of a stamp at high throughput is now possible with UV-SCIL.
Andre Geim and Konstantin Novoselov, both of the University of Manchester, UK, took the 2010 Nobel Prize in Physics, for their work developing the nano material graphene. This article includes the Laureates' work, biographies, recent graphene announcements, and more information.
Mattson Technology Inc. (NASDAQ: MTSN), advanced wafer fab process equipment supplier, received orders for multiple Suprema photoresist strip systems from a new Asian customer. The Supremas will be used in both front-end-of-line (FEOL) and back-end-of-line (BEOL) applications for advanced logic device production.
Forsyth Tech provides a 2-year nanotechnology degree program in the Southeast US. This program has strong partnerships with innovative employers, academic researchers, and industrial organizations across NC. Dr. Kevin J. Conley discusses their new lab, evolving nanotechnology curriculum, and the jobs students prep for in the program.
DEK has launched ProActiv process technology to enable electronics manufacturers to print pastes with high-density heterogeneous PCBs and ultra fine pitch assemblies such as advanced package assembly.
A spherical nanostructure, fully derived from very simple organic elements, yet strong as steel, has been developed and characterized at the laboratories of Ehud Gazit of Tel Aviv University and Itay Rousso of the Weizmann Institute of Science.
Robert Pagliaro, RP Innovative Engineering Solutions, demonstrates that simple but effective enhancements to wet clean steps can help achieve more stringent surface preparation and reduce complexity, cost of ownership (COO), and environmental concerns associated with existing methods. Contamination left or caused by cleaning and drying steps can adversely affect wafer yields.
RJR Polymers debuted a new-generation LCP quad flat-pack no-lead (QFN), air-cavity package that will support finer lead pitches, thinner leadframes and shorter wire bond lengths in a near hermetic, ROHS-compliant solution.