Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Unidym finalizes CNT licensing deals

01/21/2010 

Unidym Inc. says it has completed three agreements to nonexclusively license out its intellectual property related to carbon nanotubes (CNT) for use in applications including aerospace and military.

Peering into the nano world with a nanolens

01/15/2010 

Researchers at Northeastern U.'s Electronic Materials Research Institute have created a 3D nanolens from metamaterials to provide more accurate and detailed imaging of nanoscale objects.

A universal platform for 450mm manufacturing

12/28/2009 

A flexible, forward-thinking platform will be vital to meet cost and productivity challenges of 450mm and beyond. John Klawender and Terry Bluck from Intevac describe the concept and capabilities of a universal platform, with test and system modeling results.

Brewer Science, SWeNT funded for CNT inks

12/23/2009 

A new $6.5M funding award from NIST will support efforts from Brewer Science and Southwest Nanotechnologies to develop more cost-effective production of carbon nanotube inks for use in various electronic applications, from PV cells to optics to sensors.

Chip tool demand slows, but still rebounding

12/21/2009 

Semiconductor manufacturing equipment demand slowed a bit in November but still kept up a pace of growth, lending more weight to the outlook for improved fab spending heading into 2010, according to the latest data from SEMI and SEAJ.

SWeNT gets grants for new CNTs

12/18/2009 

Southwest Nanotechnologies Inc. (SWeNT) has received two grants from the Oklahoma Center for the Advancement of Science and Technology to help develop new single-walled carbon nanotubes (CNT) with improved electrical conductivity and transparency.

IEDM 2009: Stanford's CNT transistors

12/15/2009 

Researchers at Stanford disclosed their latest work at this year's International Electron Devices Meeting (IEDM) on combining carbon nanotubes (CNT) and logic circuits to devise new techniques for preventing flaws and building multilayer chip prototypes. The transistors are said to be grouped in the same "cascading" sequences as for computational logic and memory, with processes compatible with standard industrial-scale VLSI (very large scale integration) manufacturing.

Russian nano efforts eye solar power, nanocoatings

12/14/2009 

The Supervisory Council of the Russian Corporation of Nanotechnologies (RUSNANO) recently approved two new measures: one for producing concentrated photovoltaic technology, and participation in work to develop porous nanostructured nonmetallic coatings.

Gartner: Chip capex recovery marches on

12/14/2009 

The latest semiconductor capital spending forecast from Gartner solidifies the 2009 outlook with another positive bump-up, and the firm sees the climate significantly improving for almost all sectors well into the future. Gartner research VP Dean Freeman helps SST break down some of the numbers.

Carbon nanotubes turn paper/ink into batteries

12/08/2009 

Researchers from Stanford U. have slathered ordinary paper with a carbon nanotube/silver nanowire ink to create a supercapacitor with excellent electricity storage/conductivity properties, "at least an order of magnitude" better than lithium-ion batteries.

10 firms named top TSMC suppliers

12/07/2009 

Ten equipment and materials suppliers have received top nods from top foundry Taiwan Semiconductor Manufacturing Co. (TSMC) for contributions over the past year.

SEMI: Capex bounceback in 2010, 2011...but will chipmakers be ready?

12/04/2009 

After shrinking over the past two years to the lowest levels in two decades, global semiconductor equipment sales will surge mightily in 2010 and 2011 -- but with no real capacity upgrades, and that could spell trouble if chip demand is as robust as some believe, notes SEMI.

Building CNT circuits on DNA origami "breadboards"

12/03/2009 

Researchers at the California Institute of Technology have combined the self-assembly ability of DNA with electronic properties of carbon nanotubes to address the problem of organizing CNTs into nanoscale electronic circuits.

Good news in chip tool demand -- with a caveat

11/20/2009 

The good news continues to shine in semiconductor equipment demand for suppliers in North America and Japan, according to the latest monthly data from SEMI and the SEAJ, though some softness may warrant some attention heading into the holiday season.

In-situ nanowire measurement finds better deformability, strength

11/11/2009 

Researchers at NC State U. say they have measured properties of silicon nanowires using in-situ tensile testing, finding the material has far better elasticity and fracture properties than "regular" sized silicon material, suggesting potential for future electronics devices.

Rice tips industrial-scale CNT method

11/10/2009 

Researchers from the US and Israel say they have figured out how to make pure carbon nanotube (CNT) based on "tried-and-true" processes from the chemical industry for producing polymer fibers -- possibly unlocking the secret to producing CNTs on massive scales.

Nanocomp extends Army pact for CNT body armor

11/06/2009 

Nanocomp Technologies says the US Army Natick (MA) Soldier Systems Center has extended a contract to develop carbon nanotube materials for incorporation into body armor.

Hitachi unit improves microhole-drilling processes for PCBs

11/05/2009 

Hitachi Via Mechanics says it has developed new processes for microhole drilling cast polyimide wafers and multilayered materials used in high density electronics packaging, that can produce ≤100μm-dia. holes in high-volume manufacturing.

CDI patents CNT method for AFM probes

11/03/2009 

Carbon Design Innovations Inc. (CDI) has received a technology patent for a variety of methods and techniques for fabricating carbon nanotube (CNT) devices, notably atomic force microscopy (AFM) probes.

Study compares SOI vs. bulk for finFETs

10/23/2009 

Cost and performance between silicon-on-insulator (SOI) and bulk finFETs are "for all practical purposes equivalent," but finFETs are more challenging to manufacture due to increased process variability, according to results from a study from the SOI Industry Consortium.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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