07/14/2009  3D IC technology, an alternative approach to wire-bonded chip stacking utilizing interconnets with through-silicon vias (TSVs) fabricated with front-end-like processes, is a hot topic at SEMICON West, and the focus of an on-line virtual forum hosted by public relations firm MCA.

07/14/2009  3D IC technology, an alternative approach to wire-bonded chip stacking utilizing interconnets with through-silicon vias (TSVs) fabricated with front-end-like processes, is a hot topic at SEMICON West, and the focus of an on-line virtual forum hosted by public relations firm MCA.

07/13/2009  JULY 7, 2009

07/13/2009  After nearly a year in the red, semiconductor equipment manufacturers finally broke back above the "parity" mark for bookings vs. billings an indicator of future business stability and growth.

07/10/2009  WEB EXCLUSIVE: A quick scan across the landscape of suppliers that are betting the farm on nanotubes.

07/09/2009  Changes in market supply-demand dynamics, coupled with less favorable financing conditions brought on by the current credit crunch climate, are together redefining the type of c-Si production equipment required by cell manufacturers over the next few years, explains Coherent's Finlay Colville.

07/08/2009  SEMICON WEST PREVIEW: The much-hyped properties of materials at the nanoscale are finally starting to be applied to some real electronics applications -- e.g., thermoelectric materials based on based on spray-on semiconductor nanocrystals, ultrasensitive NEMS gas sensors, carbon nanotube-based transparent conductive films and more -- which will be on discussed and displayed at SEMICON West (July 14-16) in San Francisco.

07/07/2009  July 7, 2009: SouthWest Nanotechnologies, a developer of single-wall and specialty multiwall carbon nanotubes, is receiving $3M equity from Troy, MI-based Insight Technology Capital Partners LP to push product development, manufacturing, and marketing for both existing and new nanotube products.

07/02/2009  July 2, 2009: Researchers at Georgia Tech have developed a new statistical analysis technique that could lead to more precise and reliable measurements of nanomaterials and nanostructures.

07/01/2009  Most natural fibers and nanofibers are produced only in relatively short lengths, and most applications require a bulk or continuous material–but there is no effective method for using short fibers or carbon nanotube (CNT) powders to achieve breakthrough properties in bulk materials.

06/26/2009  Samsung engineers discuss advancements in manufacturing using the company's S1 fab, a state-of-the-art 300mm foundry line, as an example in the areas of patterning and closed loop variation control systems.

06/26/2009  June 26, 2009: KLD Energy Technologies is launching US sales of an electric scooter based on an transmissionless motor system that uses a nanocomposite material to boost energy efficiency.

06/25/2009  June 25, 2009: Raytheon Co. says it has been awarded a four-year, $6M contract (including all options) by the Defense Advanced Research Projects Agency to develop nano thermal interface materials (nTIM) to improve thermal performance of defense electronics systems.

06/22/2009  The semiconductor equipment industry still looks awful, but yet another sign of a possible bottom and rebound: May bookings saw the second-biggest M/M spike in the past five and a half years, according to data from SEMI.

06/18/2009  June 18, 2009 -- Carbon Nanotubes (CNTs) and graphene exhibit extraordinary electrical properties for organic materials, and have a huge potential in electrical and electronic applications such as sensors, semiconductor devices, displays, conductors and energy conversion devices (e.g., fuel cells, harvesters and batteries).

06/17/2009  A business risk management approach to PV equipment installation that incorporates environmental, health, and safety (EHS) considerations from the planning process through start-up can help reduce costs, minimize liability, and minimize timeframes.

06/11/2009  June 11, 2009: Engineers from the University of Pennsylvania, Sandia National Laboratories and Rice University have demonstrated the formation of interconnected carbon nanostructures on graphene substrate, in a simple assembly process that may eventually lead to a new paradigm for building integrated carbon-based devices.

06/09/2009  June 9, 2009: Xradia Inc. and NanoLab Technologies Inc. have formed a partnership to offer 3D X-ray imaging as part of a service model to help address semiconductor packaging development and failure analysis challenges.

06/01/2009  Day 4 of the ECS Spring 2009 Meeting saw the continuation of symposia on flexible electronics, emerging dielectrics, SOI, and graphene, reports Techcet's Michael A. Fury in his exclusive daily blog for SST. And discussions of battery/energy and SOI device technology indicated the global breadth of research interest and funding in these fields.

05/28/2009  Techcet's Michael A. Fury reports exclusively for SST from this week's spring meeting of the Electrochemical Society. On tap for Day 2: "Tantalizing" advancements in ZnO as a future semiconductor material, cost-effective 2D microfluidics, triple-junction solar cells, a supersensitive toxin-detecting HEMT device, and feeling the effects of "Fox News flu."