Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Funding for nanotech-enabled anti-corrosion technology

05/21/2009  May 21, 2009: Washington Technology Center has awarded a grant to the University of Washington to support an advanced material research collaboration with Seattle-based Modumetal Inc. to develop a material for corrosion protection of ConocoPhillips' commercial sulfuric acid production pipelines.

Zyvex, PolyOne get $4.9M to develop carbon nanotube composites

05/18/2009  May 18, 2009: PolyOne Corp. and Zyvex Performance Materials have received a $4.9 million grant from the Ohio Third Frontier Commission that will fund further development and production of carbon-nanotube composites.

Life Technologies licenses quantum dots to Zymera

05/15/2009  May 15, 2009: Zymera will use Life Technologies' Qdot nanocrystals to create new, self-illuminating quantum dot products to improve in-vivo imaging, biomarker discovery and a growing number of biosensing applications.

Harman Receives IEEE Award for Wire Bonding Improvements

05/13/2009  George G. Harman, a researcher at NIST, contributed enormously to wire bonding technology and helped transform a labor-intensive, manual procedure into the present automated, reliable process capable of producing hundreds of billions of packaged semiconductor devices/year. The IEEE honors him with the 2009 IEEE Components, Packaging, and Manufacturing Technology Award.

Zyvex nanotubes go into experimental boat

05/13/2009  May 13, 2009: Zyvex Performance Materials, has unveiled plans for a new boat to be made entirely with its next-generation carbon nanotube-enhanced Arovex material, to demonstrate what future boats are capable of when built with new nano-enhanced materials.

IMEC's "noble" efforts to integrate nanophotonics with hi-speed CMOS

05/06/2009  IMEC researcher Pol Van Dorpe gives SST a look at the physics and structure behind a new method to integrate high-speed CMOS electronics and nanophotonic circuitry based on plasmonic effects, which has promise in applications from biosensing to thin-film solar cells.

Illumina alleges Affymetrix patent infringement

05/05/2009  May 5, 2009: Microarray developer Illumina said it has filed a patent infringement lawsuit against another microarray developer, Affymetrix.

Heatsink Assembly for BGAs

05/05/2009  The superGRIP heatsink assembly from Advanced Thermal Solutions, Inc. features a heatsink, phase-change interface material, and unique attachment system for mounting onto a wide range of hot -running BGA components. The novel design is said to require minimal space on a PCB and eliminates the need for thru holes in the board.

Next-gen Enclosed Print Head

05/05/2009  DEK International has introduced ProFlow Evolution, it's next-generation ProFlow enclosed print head solution, to expand the system's capabilities to apply to a variety of applications including traditional solder paste printing, flux deposition, adhesives and encapsulant printing, solder spheres, thermal interface materials, and more.

Method integrates nanophotonic circuitry with ICs

05/04/2009  May 4, 2009: European independent nanoelectronics research consortium IMEC says it has developed a method to integrate high-speed CMOS electronics and nanophotonic circuitry based on plasmonic effects.

Nanoneedle is small in size, huge in applications

04/29/2009  April 29, 2009: Researchers at the University of Illinois have developed a membrane-penetrating nanoneedle for the targeted delivery of one or more molecules into the cytoplasm or the nucleus of living cells, and be used as an electrochemical probe or optical biosensor.

Florida State gets powerful new JEOL microscope

04/29/2009  April 29, 2009: Scientists at Florida State University (FSU) will finally be able to clearly see what misoriented atoms are up to along the defects of the new materials that they are developing and how they relate to neighbors, with a new JEOL atomic resolution Scanning Transmission Electron Microscope to be delivered later this year.

Desalination newsletter highlights nanoparticle warnings

04/23/2009  April 23, 2009: A water desalination industry publication is running warnings of potential dangers of nanoparticles used in developing desalination technologies.

Nanocomp to develop CNT wiring, shielding for USAF

04/21/2009  April 21, 2009: Nanocomp Technologies, a developer of energy saving performance materials and component products from carbon nanotubes (CNT), has been awarded two new contracts by the United States Air Force under the Department of Defense's Small Business Innovation Research (SBIR) program.

Searching for the bottom: Half the equation fulfilled?

04/20/2009  The market for chip tools is still awful, but a slowing in declines in tool orders may offer some hope, and what may be the first step in a long road back to an industry turnaround.

Abound Solar opens its first CdTe PV production facility

04/16/2009  Top exec Pascal Noronha tells PVWorld's Debra Vogler about Abound Solar's (nee AVA Solar) new production facility and its continuous in-line manufacturing process which generates a solar panel from glass in <2hrs, and how it all translates into <$1 manufacturing costs vs. sales.

Plasma Cleaning and Surface Modification for Microelectronics

04/13/2009  By Gene Dunn, Panasonic Factory Solutions of America
Plasma technology offers a dry cleaning process that uses ionized gasses in vacuum chambers to remove contaminants for improved yields in gold bonding processes. Additionally, Auger electron spectroscopy (AES) is a useful analytical technique for determining the elemental surface characteristics and the effectiveness of plasma treatment to remove contaminants. This article discussed both.

Inlustra starts GaN production for LEDs

04/13/2009  April 13, 2009: Inlustra Technologies, a California-based startup spun out from gallium nitride (GaN) research laboratories at the University of California at Santa Barbara, has developed a scalable production process for nonpolar and semipolar GaN substrates.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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