Materials and Equipment

MATERIALS AND EQUIPMENT ARTICLES



Pitt, NETL researchers report "impossible" molecular chain reaction

12/12/2008  December 12, 2008: People said it couldn't be done, but researchers from the University of Pittsburgh and the US Department of Energy National Energy Technology Laboratory (NETL) in Pittsburgh demonstrated a molecular chain reaction on a metal surface, a nanoscale process with sizable potential in areas from nanotechnology to developing information storage technology.

Wafer-level Probe Operating Environment

12/11/2008  The ProberBench Operating Environment, from SUSS MicroTec Test Systems, is a full-featured software suite designed for efficient, intuitive and safe wafer-level probing. The ProberBench Operating Environment, from SUSS MicroTec Test Systems is a full-featured software suite designed for efficient, intuitive and safe wafer-level probing. Development of the interface and architecture was reportedly based on a three-month user study in the laboratories semiconductor design houses and manufacturers.

Learn, Explore, Share at BiTS Workshop 2009

12/11/2008  The Burn-in and Test Socket Workshop (BiTS), co-sponsored by Advanced Packaging magazine, celebrates its tenth annual gathering, March 8

New hybrid nanostructures detect nanoscale magnetism

12/09/2008  December 9, 2008: Researchers at Rensselaer Polytechnic Institute have developed and demonstrated a new method for detecting the magnetic behaviors of nanomaterials, using single multi-walled carbon nanotubes embedded with cobalt.

Cohu's Delta Design to Acquire Rasco GmbH

12/08/2008  Delta Design, a subsidiary of Cohu Inc., has agreed to purchase Rasco GmbH from Dover Corp. for $80M in cash to be funded out of Cohu's existing cash reserves. According to James A. Donahue, president and CEO, Cohu, the acquisition extends Cohu's position in the IC test handler industry and contributes to industry consolidation.

SMSC unveils high-accuracy, low-cost temperature sensors

12/04/2008  December 4, 2008: SMSC has announced two new families of high-accuracy, low-cost temperature sensors, targeting applications such as notebook PCs, servers, and industrial and embedded systems.

Nanosensors introduces carbon nanotube AFM probes

12/02/2008  December 2, 2008: Nanosensors has added a carbon nanotube SPM probe to its scope of products.

ALD NanoSolutions receives patent, and small business technology transfer grant

12/02/2008  December 2, 2008: The University of Colorado< has been awarded U.S. Patent number 7,426,067 "Atomic layer deposition on micro-mechanical devices," which has been exclusively licensed to ALD NanoSolutions Inc.

IBN's Ying named among "One Hundred Engineers of the Modern Era"

12/01/2008  December 1, 2008: IBN executive director Professor Jackie Y. Ying was recognized as one of "One Hundred Engineers of the Modern Era" at the American Institute of Chemical Engineers (AIChE) Centennial Celebrations in 2008. The list recognizes 100 chemical engineers who have made significant contributions to the profession after World War II.

AlSiC Metal Matrix Composite Assemblies

12/01/2008  AlSiC hermetic packaging assemblies from CPS Technologies offer an alternative to traditional thermal management hermetic packaging materials such as CuMo and CuW. The combinations of lightweight, high thermal conductivity, CTE matching, and low cost make it appropriate for applications in which thermal management and/or weight are important.

Cleanroom floors ‘LEED’ the way to greener facilities

12/01/2008  What is the impact of environmental concerns on today’s clean environments?

George Washington University establishes new Institute for Nanotechnology

11/28/2008  November 28, 2008: The George Washington University has announced the establishment of the GW Institute for Nanotechnology.

Raymor Industries' SE Techno Plus receives AS 9100 certification

11/26/2008  November 26, 2008: Raymor Industries Inc., a developer and producer of nanotubes and nanomaterials, says its SE Techno Plus division has received AS 9100 certification for its operations, which consists of the manufacturing, repair, and precision grinding of aerospace and industrial components.

Oerlikon Esec and M

11/26/2008  Oerlikon Esec, semiconductor equipment manufacturer, and M

Avo Photonics to produce Luna Technologies' Phoenix 1000

11/20/2008  November 20, 2008: Optical packaging specialist Avo Photonics has been selected as the manufacturing facility for Luna Technologies' PHOENIX 1000, a MEMS-based external cavity laser which offers low noise and precise tuning capability over the C-band.

IMAPS International 2008 In Review

11/17/2008  By Gail Flower, Editor-in-Chief
This year's IMAPS International Symposium had great international participation, good attendance and excellent presentations from keynoters to the technologically cutting-edge educational papers. It was election day when the IMAPS conference began, and by the second day of the conference, a new president entered the picture. Therefore, the first day proceeded without a rush of attendees as expected, but the second perked up with lively conversation.

Advisory Board

11/17/2008 

By R. Wayne Johnson, Ph.D., Auburn University

While $4/gal.gasoline prices have dropped, it is inevitable they will rise again. So what does this have to do with advanced packaging? A lot! While we hear discussions of alternate energy, we will continue to use oil for the foreseeable future. Electronics (and advanced packaging) are important for measurements during well drilling and for production management over the life of the well.

Stress-free Epoxy
Cotronics, Corp.


11/17/2008  Duralco 125 stress-free epoxy from Cotronics Corp. forms a flexible, electrically conductive bond for continuous use to 400°F. It reportedly provides outstanding electrical conductivity, high bond strength, thermal and mechanical shock resistance, adhesion to dissimilar substrates, and chemical resistance.

SEMI: Wafer shipments step back in 3Q

11/14/2008  Worldwide silicon wafer shipments slowed nearly 3% in 3Q08, their biggest quarterly dip in nearly six years, following what had been a nice recovery in the second quarter, before the macroeconomic climate soured, according to new data from SEMI's Silicon Manufacturers Group (SMG).

Response surface methods for peak process performance

11/13/2008  Response surface methods (RSM) provide statistically validated predictive models that can be manipulated for finding optimal process configurations that exhibit minimal variability. This article introduces two RSM enhancements that focus on achieving robust operating conditions.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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