02/27/2008  ; Based on its commitment to success and ability to meet a set of challenging objectives, the Electronics and Industrial Groups of Henkel have been awarded Prime Source Awards from Atlanta-based EIS, an electrical/electronics industry distributor. EIS president and CEO, Bob Thomas, presented the awards to Henkel's Jim Sharp, Electronics Goup southeastern territory manager, and Ken Helfers, industrial group distribution account executive.

02/26/2008  Rudolph Technologies Inc. has become the first semiconductor equipment supplier company to join Sematech's Metrology Program headquartered at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany in New York.

02/26/2008  While the book-to-bill ratio has risen steadily to 0.89 since September 2007, when it dipped to .79, billings themselves are still 7% less then December 2007, and 12% less than a year ago, according to the January 2008 Book-to-Bill Report published by SEMI.

02/26/2008  Feb. 26, 2008 - Rohm and Haas Electronic Materials and IBM have agreed to jointly develop patterning materials and processes to enable implant at and below the 32nm node.

02/22/2008  NEC Corp. has developed a carbon nanotube transistor using a coating process

02/21/2008  ; Rudolph Technologies Inc. and SEMATECH, have announced that Rudolph has become the first semiconductor equipment supplier company to join SEMATECH's Metrology Program headquartered at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.

02/21/2008  ; MEPTEC, the MicroElectronics Packaging and Test Engineering Council, has finalized the program for its 4th Annual Thermal Management symposium titled "The Heat Is On: Thermal Technology Solutions for Advanced Products." This one-day technical event will be held on February 28, 2008, at the Wyndham Hotel, San Jose, CA.

02/20/2008  Feb. 20, 2008 - New data from SEMI and the Semiconductor Equipment Association of Japan (SEAJ) fuels continued concerns of a soft investment climate among global chipmakers.

02/20/2008  ; Semiconductor Research Corp. (SRC), a university-research consortium for semiconductors and related technologies, has announced that the College of Nanoscale Science and Engineering (CNSE) of the U. at Albany will serve as headquarters for a research effort aimed at enabling nanoelectronics advances that are critical for the development of smaller, faster and cheaper computer nanochips.

02/20/2008  ; Techcet Group LLC reports the market for interconnect metals and dielectric materials, totaling $350 million in 2007, is maintaining its lead as the highest growth area compared to other semiconductor process materials. The latest edition of the Techcet report "Advanced Interconnect Materials for the 65 through 32nm Nodes" discusses the materials used and likely to be used in subsequent technology generations for logic and memory products.

02/20/2008  Nanocomp Technologies Inc. says it has successfully produced 3-foot by 6-foot sheets of carbon nanotube felted fabric. The highly conductive material is composed of Nanocomp's millimeter-long nanotubes.

02/19/2008  by Katherine Derbyshire, Contributing Editor, Solid State Technology
The vast majority of solar cells depend on p-n junctions in inorganic semiconductors, but their limitations have inspired investigation of a variety of alternate means for harnessing the sun's energy. One of the most successful alternative designs is dye-sensitized solar cells

02/19/2008  Nanomaterials developer Ecology Coatings Inc. has been awarded its fifth patent, this one covering processes and technologies for producing environmentally friendly nanotechnology-enabled coatings.

02/18/2008  The Wire Bonder 3200's new air bearing technology and rotary axis enable it to attain 22 wires/sec with very thin wires (for diameters down to 35 µm, or 35 thousandths of a millimeter). The wire bonder makes the electrical connections between the semiconductor and the terminals on the substrate. The control pulses generated in the chip reach the surrounding area via a gold wire that is thinner than a human hair.

02/15/2008  Feb. 15, 2008 - NEC says it has developed a carbon nanotube (CNT) transistor using a new channel-coating process, achieving "extremely high mobility" despite performance variation. Results of the research are being presented at this week's nano tech 2008 International Nanotechnology Exhibition & Conference in Tokyo.

02/13/2008  ; NEC Corp. has announced the successful development of a carbon nanotube (CNT) transistor using a coating process. The basic operation of the new transistor with advanced characteristics has been verified, confirming its

02/08/2008  Feb. 8, 2008 - Legacy Holding, a provider of wafer cleaning/strip technologies, says it has submitted a patent application for its proprietary "Organostrip" photoresist removal technology used in backend semiconductor manufacturing processes, saying that opportunities in China's IC industry make it a sweet spot for business.

02/06/2008  Ecology Coatings Inc. has signed a letter of intent with the U.S. Automotive Partnership for Advancing Research & Technologies (USAutoPARTS) to participate in a nonprofit automotive research initiative program.

02/04/2008  This company's latest M1 AOI system, the M1m, has been developed with special design enhancements to address the advanced inspection challenges presented by complex wire bonding, epoxy splash, and ever-shrinking component sizes. The system offers advanced high-speed device inspection with good defect coverage.

02/04/2008  ; Infineon Technologies has announced it is shipping in volume RF switches that are manufactured in a CMOS-based process on silicon wafers and offer the equivalent performance of RF switches manufactured in gallium arsenide (GaAs) process technology. Infineon went on to say that, previously, CMOS-based RF switches had to be manufactured on dedicated and more expensive sapphire wafers to reach the performance of GaAs switches.