03/01/2007  anufacturers and OEMs need a package-level cooling solution that provides cooling in close proximity to the chip, to cool hot spots and smooth out non-uniform power dissipation.

03/01/2007  Theories on thermal management rival, in number and variety, strategies for winning the Super Bowl or baking the perfect loaf of bread.

03/01/2007 

03/01/2007  When it comes to electronic products, the more power, speed, and functionality jammed into a smaller package, the better.

03/01/2007  Have you ever taken a Latin dance class? At first glance, everyone comes off as shy, and then the movement heats up.

03/01/2007  As micro- and nanotechnologies begin to mature, industry salaries increase

02/27/2007  February 27, 2007 - Taiwan Semiconductor Manufacturing Co. (TSMC), recent beneficiary of relaxed government regulations regarding transfer of process technologies to mainland China, will likely utilize used equipment from NXP Semiconductor in order to triple the output from its 200mm, 30,000 WPM capacity site in Shanghai, according to the Taiwan Economic News.

02/26/2007  February 26, 2007 - Air Products has agreed to refurbish semiconductor equipment owned by or consigned to Babcock & Brown Electronics Management, an equipment leasing firm, out of Air Products' Chandler, AZ facility. Repair and refurbishment will be performed prior to resale, adjusted to meet customers' requirements for reliability and refurbishment "to the most recent configuration possible," and in some cases involving the tool OEM.

02/23/2007  February 23, 2007 - Japanese DRAM firm Elpida Memory Inc. said it has agreed to sell 200mm wafer processing equipment from its Hiroshima facility to Cension Semiconductor Manufacturing Corp. in order to narrow its focus to 300mm chipmaking operations.

02/22/2007  Andigilog received $18 million in a series B financing round, with four new investors and three returning venture capital companies. The thermal management solutions company will use this funding to penetrate for desktop, notebook, and cooling fan markets; and to extend its product portfolio.

02/21/2007  Stanford University researchers are using carbon nanotubes to transport gene therapy drugs into T-cells. The effect is prevention of the dreaded HIV virus from entering cells in vitro.

02/20/2007  The proliferation of DFM start-ups has set the stage for a plethora of announcements in the months leading up to the SPIE Microlithography Conference. In this three-part series, WaferNEWS interviews companies that are trying to make their mark on the DFM landscape. This week we look at a company with technology that predicts, during the design phase, how ideal GDS shapes will print as contours in silicon: Clear Shape Technologies.

02/16/2007  February 16, 2007 - Honeywell Electronic Materials, Tempe, AZ, says it will invest >$1 million to expand its advanced packaging materials R&D center in Spokane, WA.

02/16/2007  February 16, 2007 - The Fabless Semiconductor Association (FSA) has released the first tool in a planned "ecosystem" of IP deliverables that aims to address pain points of IP integration by enabling more effective communication between IP vendors, fabless companies, IDMs, and foundries.

02/16/2007  February 16, 2007 - Researchers at the U. of California-Riverside have designed the building blocks for a memory device that uses telescoping binary or three-stage carbon nanotubes as high-speed, low-power microswitches.

02/15/2007  Honeywell Electronic Materials will expand its Spokane, WA, R&D center for advanced packaging materials, investing more than $1 million and adding about 85 pieces of equipment. The company plans to develop thermal management, electrical interconnect, and burn-in materials. The construction project is expected to finish by the end of 2007.

02/12/2007  In a drive to ramp up development of revolutionary materials, Ford has invested $2 million in Imago's Local Electrode Atom Probe tomograph (LEAP), which Ford anticipates will lead to new materials being incorporated into vehicle design faster than previously imagined.

02/09/2007  February 9, 2007 - Significant overcapacity problems for flat-panels contributed to a double-digit decline in sales of manufacturing equipment for TFT-LCDs in 2006 -- and the situation will only get worse this year, according to data from The Information Network.

02/09/2007  Nextreme Thermal Solutions appointed Seri Lee, Ph.D., as chief technology officer. Bringing Lee to Nextreme is part of a corporate plan to focus on electronic and optoelectronic packaging, and thermal management, said Jesko von Windheim, CEO, adding that Lee will also advance the company's efforts in thermoelectric power generation.

02/09/2007  Nanotechnology was a major focus of a press briefing by National Institute of Standards and Technology (NIST) director William Jeffrey this week. Jeffrey noted that President Bush's 2007 and 2008 budget requests include $26 million for nano initiatives. This includes funding for the NIST Center for Nanoscale Science and Technology, a partnership that combines a nanofabrication and nanometrology facility with research.