10/30/2017  The O-S-D market segments are growing at above average rates in 2017 and all three are expected to reach new record highs for the first time in six years, says new update.

10/27/2017  NXP Semiconductors N.V. (NASDAQ:NXPI) today debuted two significant technology breakthroughs at the largest fintech innovation event, Money 20/20, October 22-25, 2017, in Las Vegas.

10/27/2017  Microsemi Corporation and Knowles Corporation jointly announced today that Microsemi has entered into a definitive agreement to acquire the high performance timing business of Vectron International, a Knowles company, for $130 million.

10/27/2017  The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit.

10/26/2017  New technology from IBM Research could be used to create an inexpensive sensor network that autonomously monitors for natural gas leaks.

10/25/2017  Researchers see performance boost in novel method for connecting thin-film piezoelectric materials to flexible substrates, with potential applications for medical devices.

10/25/2017  Over 30,000 attendees are expected to convene at SEMICON Japan at Tokyo Big Sight in Tokyo on December 13-15.

10/24/2017  STMicroelectronics has taken underwater accuracy to new heights with its latest miniature pressure sensor, which is featured in the new Samsung Gear Fit 2 Pro.

10/23/2017  Rice University researchers show their flexible fibers work well but weigh much less.

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

10/17/2017  Showcasing critical issues shaping the entire electronics manufacturing supply chain.

10/17/2017  With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.

10/16/2017  The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the formation of an Automotive Birds of a Feather (BoF) Group to solicit industry input from original equipment manufacturers (OEMs) and their suppliers to enhance existing or develop new interface specifications for automotive applications.

10/13/2017  ArterisIP, the supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the FDXcelerator Partner Program.

10/12/2017  GLOBALFOUNDRIES today unveiled AutoPro, a new platform designed to provide automotive customers a broad set of technology solutions and manufacturing services that minimize certification efforts and speed time-to-market.

10/11/2017  TMC will invest approximately 110 billion yen as a second investment in Fab 6 for the installation of additional manufacturing equipment in the Phase-1 clean room.

10/06/2017  Gartner, Inc. this week highlighted the top strategic technology trends that will impact most organizations in 2018.

10/05/2017  MSIG announces five finalists for Technology Showcase at MEMS & Sensors Executive Congress, November 1-2, in Napa Valley, Calif.

10/04/2017  A team of University of Wisconsin–Madison engineers has created the most functional flexible transistor in the world -- and with it, a fast, simple and inexpensive fabrication process that’s easily scalable to the commercial level.

10/03/2017  Workshop will highlight rapid advancements in automotive electronics technologies and applications, and explore technical and business barriers and opportunities that are best addressed collectively across the supply chain.