MEMS

MEMS ARTICLES



Equipment spending up: 19 new fabs and lines to start construction

06/10/2016  While semiconductor fab equipment spending is off to a slow start in 2016, it is expected to gain momentum through the end of the year. For 2016, 1.5 percent growth over 2015 is expected while 13 percent growth is forecast in 2017.

Novel energy inside a microcircuit chip

06/09/2016  VTT developed an efficient nanomaterial-based integrated energy.

China-based smartphone suppliers held 8 of Top 12 spots in first quarter ranking

06/09/2016  An India-based smartphone supplier -- Micromax -- joins the top 12 ranking for the first time.

High Tech U in Taiwan for first time

06/07/2016  The SEMI High Tech U learning program commenced April 20-22 in Hsinchu, Taiwan.

imec, partners develop Wi-Fi HaLow radio solution for IoT applications

06/06/2016  At this week’s Design Automation Conference (DAC 2016), nanoelectronics research center imec, Holst Centre (initiated by imec and TNO), and Wi-Fi IP provider Methods2Bussiness will present a complete Wi-Fi HaLow radio solution.

Cadence next-generation Virtuoso platform deployed by STMicroelectronics for SmartPower Technologies

06/02/2016  Cadence Design Systems, Inc. today announced that STMicroelectronics has qualified and actively deployed the next-generation Cadence Virtuoso platform for its SmartPower technologies.

Will conductive inks help wearables go truly wearable?

06/02/2016  The first generation of wearable devices are constructed using mature, rigid technologies put inside a new box that can be worn. These are often bulky devices that are not truly wearable in the sense that our clothes are. This is, however, beginning to change, albeit slowly.

Advanced power technology from STMicroelectronics enables unique portable e-car charger from Zaptec

05/31/2016  Silicon-carbide (SiC) power electronics from STMicroelectronics has enabled the creation of ZapCharger Portable, the world's smallest, smartest, and safest electric-car charging station from Zaptec, an innovative start-up company that has revolutionized the transformer industry.

Long-term strategy pays off as TI maintains analog leadership

05/31/2016  Infineon, Skyworks Solutions move up, ST slips in shakeup of top analog suppliers of 2015.

An increasing number of healthcare applications is using bioMEMS components

05/27/2016  According to Yole Développement (Yole) analysts, this market will triple from US$2.7 billion in 2015 to US$7.6 billion in 2021.

MACOM launches new GaN power transistors

05/26/2016  MACOM Technology Solutions reported the newest entries in its MAGb series of GaN on Silicon power transistors for use in macro wireless basestations.

The next generation of carbon monoxide nanosensors

05/26/2016  Scientists have been investigating sensors that can determine CO concentration, and a team from the Okinawa Institute of Science and Technology Graduate University (OIST), in tandem with the University of Toulouse, has found an innovative method to build such sensors.

MEMS technology is contributing to the inkjet printing industry revolution

05/25/2016  With a market reaching US$ 1 billion in 2021, the MEMS printhead is one of the most mature MEMS devices.

Imec, Holst Centre and Barco Silex collaborate on data security for wearables and IoT networks

05/25/2016  Nanoelectronics research center imec, Holst Centre (set up by imec and TNO) and micro-electronic design house Barco Silex, belonging to the Barco group, today announced that they will collaborate to implement data security into sensors for wearable devices and Internet of Things (IoT) sensor networks.

Smart city devices to top 1 billion units in 2025

05/25/2016  Global unit shipments of smart city devices, which are internet-connected devices used in smart city projects, will increase from 115.4 million in 2015 to 1.2 billion in 2025.

Optics breakthrough to revamp night vision

05/25/2016  A breakthrough by an Australian collaboration of researchers could make infra-red technology easy-to-use and cheap, potentially saving millions of dollars in defence and other areas using sensing devices, and boosting applications of technology to a host of new areas, such as agriculture.

North American semiconductor equipment industry posts April 2016 book-to-bill ratio of 1.10

05/24/2016  North America-based manufacturers of semiconductor equipment posted $1.59 billion in orders worldwide in April 2016 (three-month average basis) and a book-to-bill ratio of 1.10.

Imec and Holst Centre present multi-standard low-power wide-area radio chip

05/24/2016  The nanoelectronics research centers imec and Holst Centre (set up by imec and TNO), presented a low-power wide-area (LPWA) multi-standard radio chip today at imec's annual technology forum in Brussels (ITF Brussels 2016).

Fujitsu boosts efficiency of manufacturing processes at Shimane Fujitsu through IoT collaboration with Intel

05/19/2016  Fujitsu Limited today announced that it has with Intel Corporation carried out a field trial to visualize manufacturing processes at Shimane Fujitsu Limited.

STMicroelectronics, Arduino launch cooperation to expand maker-community access to STM32 MCUs and sensors

05/19/2016  Moving to enable makers to make even more than before, STMicroelectronics and Arduino today announced an agreement that brings the STM32 family of microcontrollers (MCU), along with ST's full portfolio of sensing, power, and connectivity technology, even closer to the Arduino maker community.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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