MEMS

MEMS ARTICLES



A human enzyme can biodegrade graphene

08/24/2018  Graphene Flagship partners discovered that a natural human enzyme can biodegrade graphene. These findings could have great implications in the development of graphene-based biomedical devices.

Gartner identifies five emerging technology trends that will blur the lines between human and machine

08/23/2018  The 35 must-watch technologies represented on the Gartner Inc. Hype Cycle for Emerging Technologies, 2018 revealed five distinct emerging technology trends that will blur the lines between humans and machines.

Samsung's Exynos i S111 delivers efficiency and reliability for NB-IoT devices

08/23/2018  New IoT solution includes modem, processor, memory and GNSS functions in one chip.

Worldwide semiconductor revenue hit record $120.8B in Q2 2018

08/22/2018  Samsung Electronics, Intel and SK Hynix continued to lead the semiconductor market in Q2 2018.

Semtech’s LoRa technology creates IoT metering solutions to improve facility management in China

08/22/2018  EasyLinkin’s LoRa-based IoT solutions gather data and analytics on utility usage.

New material could improve efficiency of computer processing and memory

08/22/2018  Discovery could have major impact on semiconductor industry.

Murata invests in MEMS sensor manufacturing in Finland

08/21/2018  Murata Manufacturing Co., Ltd. expands its MEMS sensor manufacturing by building a new factory in Vantaa, Finland to increase the sensor production capacity.

SiFive announces first open-source RISC-V-based SoC platform with NVIDIA Deep Learning Accelerator technology

08/20/2018  SiFive, a provider of commercial RISC-V processor IP, today announced the first open-source RISC-V-based SoC platform for edge inference applications based on NVIDIA's Deep Learning Accelerator (NVDLA) technology.

CTA study: China tariffs will cost the U.S. economy up to $2.4B annually

08/17/2018  The Trump administration's consideration of tariffs on Chinese printed circuit assemblies and connected devices would cost the economy $520.8 million and $2.4 billion annually for the 10 percent and 25 percent tariffs, respectively, according to a new study commissioned by the Consumer Technology Association (CTA).

Novel sensors could enable smarter textiles

08/17/2018  University of Delaware engineers use carbon nanotube composite coatings.

NSF awards $1.2M to Rochester Institute of Technology, University of California-San Diego, University of Delaware

08/14/2018  Academic institutions partner with AIM Photonics to realize advanced computing architecture using light; develop mobile probes for identifying specific materials; and enable improved manufacturing processes for photonic devices.

SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

TowerJazz to hold Technical Global Symposium (TGS) in China

08/14/2018  TowerJazz, the global specialty foundry, announced details of its China Technical Global Symposium (TGS) event in Shanghai on August 22, 2018.

'Building up' stretchable electronics to be as multipurpose as your smartphone

08/13/2018  By stacking and connecting layers of stretchable circuits on top of one another, engineers have developed an approach to build soft, pliable "3D stretchable electronics" that can pack a lot of functions while staying thin and small in size.

European electronics industry CEOs call on European Commission to bolster sector's competitiveness

08/08/2018  In a bid to reinvigorate Europe’s electronics strategy and strengthen the region’s position in key emerging technologies, European electronics industry CEOs in June called on public and private actors to accelerate collaboration at the European Union and national levels.

Average design cost for basic SoCs across all geometries was $1.7M in 2017, says Semico Research

08/07/2018  The semiconductor industry today is faced with several substantial issues-not the least of which are the continuing rise in design costs for complex SoCs, the decrease in the incidence of first-time-right designs and the increase in the design cycle time against shrinking market windows and decreasing product life cycles.

Integrated sensor could monitor brain aneurysm treatment

08/07/2018  A multi-university research team has demonstrated proof-of-concept for a highly flexible and stretchable sensor that could be integrated with the flow diverter to monitor hemodynamics in a blood vessel without costly diagnostic procedures.

SEMI High-Tech Facility events: Shaping the future of smart factories in Taiwan

08/02/2018  The march to greater precision, efficiency and safety – the lifeblood of high-technology manufacturing facilities – has taken on a new urgency as emerging applications such artificial intelligence (AI), the Internet of Things (IoT) and Industry 4.0 give new meaning to smart factories.

Wearable devices: Useful medical insights or just more data?

08/02/2018  A new review looks at the booming industry of measuring 'every breath you take and every move you make'.

Xperi partners with UMC to support production of direct and hybrid bonding 3D semiconductor technologies

08/02/2018  Partnership enables UMC to develop and manufacture products utilizing Invensas DBI and ZiBond technologies.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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