MEMS

MEMS ARTICLES



Lead islands in a sea of graphene magnetize the material of the future

12/16/2014  Researchers in Spain have discovered that if lead atoms are intercalated on a graphene sheet, a powerful magnetic field is generated by the interaction of the electrons' spin with their orbital movement.

Synopsys and imec expand TCAD collaboration to 5nm and beyond

12/16/2014  Synopsys, Inc. today announced the expansion of its collaboration with imec (nanoelectronics research center imec) to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond.

What’s next for MEMS?

12/16/2014  The proliferation of sensors into high volume consumer markets, and into the emerging Internet of Things, is driving the MEMS market to maturity, with a developed ecosystem to ease use and grow applications. But it is also bringing plenty of demands for new technologies, and changes in how companies will compete.

Innovation in the shadow of volcanic change

12/16/2014  The semiconductor equipment and materials industry is currently enjoying a double-digit annual growth rate and good prospects looking forward to 2015.

Stacking 2-dimensional materials may lower cost of semiconductor devices

12/12/2014  A team of researchers led by North Carolina State University has found that stacking materials that are only one atom thick can create semiconductor junctions that transfer charge efficiently, regardless of whether the crystalline structure of the materials is mismatched - lowering the manufacturing cost for a wide variety of semiconductor devices such as solar cells, lasers and LEDs.

Murata completes acquisition of Peregrine Semiconductor

12/12/2014  Murata Electronics North America, Inc. and Peregrine Semiconductor Corporation, founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, today announce that Murata has acquired all outstanding shares of Peregrine.

?System Plus analyzes the world's smallest ?microbolometer-based thermal imaging ?camera core released by FLIR

12/11/2014  Initially focused on the military, uncooled thermal camera sales have grown significantly due to substantial cost reduction of micro bolometers and growing adoption in commercial markets, including thermography, automotive and surveillance applications.

Intel announces IoT platform

12/11/2014  Intel Corporation today announced the Intel IoT Platform, an end-to-end reference model designed to unify and simplify connectivity and security for the Internet of Things (IoT).

3D TSV begins

12/10/2014  “Engineering samples have already started to ship and preparation is on-going for entering volume manufacturing,” announces Yole.

OCEASOFT harnesses SIGFOX IoT network in Cobalt S3 sensor family for cloud connectivity

12/09/2014  Industrial Internet of Things sensor-monitoring solution opens new vistas in pollution and environmental applications, other remote-sensing sectors.

TSMC recognizes outstanding suppliers at Supply Chain Management Forum

12/09/2014  TSMC held its 14th annual Supply Chain Management forum on December 4, 2014 to show appreciation for the support and contributions of its suppliers in 2014, and to recognize nine outstanding equipment and materials suppliers.

Veeco completes acquisition of Solid State Equipment Holdings LLC

12/08/2014  Veeco Instruments Inc. announced that it has acquired privately held Solid State Equipment Holdings LLC (“SSEC”), based in Horsham, Pennsylvania.

Silicon Image launches new subsidiary to focus on Internet of Everything services

12/04/2014  Silicon Image, a provider of multimedia connectivity solutions and services, announced that Qualcomm Technologies, Inc. has made a $7 million strategic investment in Silicon Image’s new subsidiary, Qterics, for a 7% ownership interest.

Imec and Holst Centre announce IC and open hardware development kit for personal health monitoring

12/04/2014  At next week’s mHealth Summit 2014, held Dec. 7-11 in Washington, D.C., nanoelectronics research center imec and Holst Centre will showcase at their booth a development kit based on an open hardware platform using a highly integrated multi-sensor data acquisition chip.

What to expect from the 3rd Edition of the European 3D TSV Summit

12/04/2014  Interview with SEMI Europe’s Yann Guillou gives attendees a preview of the event.

Global semiconductor sales increase in October; Substantial growth projected for 2014

12/03/2014  The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $29.7 billion for the month of October 2014, an increase of 9.6 percent from the October 2013 total.

Wireless nanorod-nanotube film enables light stimulation of blind retina

12/03/2014  Breakthrough could lead to artificial retinas for visually impaired. Combining semiconductor nanorods and carbon nanotubes, it could potentially form part of a future prosthetic device that replaces damaged retinal cells.

AXSEM and SIGFOX announce ‘ultra-low-power’ System-on-Chip solution

12/03/2014  AXSEM, a developer of lowest-power radio microcontrollers, and SIGFOX, a developer of cost-effective, energy-efficient Internet of Things connectivity, today announced that AXSEM’s system-on-chip (SoC) with an AX8052 microcontroller has been certified SIGFOX Ready for two-way connectivity.

Imec partners with Huawei on high-bandwidth optical data link technology

12/03/2014  Nanoelectronics research center imec and global ICT leader Huawei announced today that they have taken a further step in their strategic partnership focusing on optical data link technology.

Cypress and Spansion to merge in $4B all-stock transaction

12/03/2014  Cypress Semiconductor Corp. and Spansion, Inc. this week announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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