06/08/2015  IBM researchers develop a technique for integrating 'III-V' materials onto silicon wafers, a breakthrough that may allow an extension to Moore's Law.

06/03/2015  The Semiconductor Industry Association (SIA) announced worldwide sales of semiconductors reached $27.6 billion for the month of April 2015, 4.8 percent higher than the April 2014 total of $26.3 billion and 0.4 percent lower than last month's total of $27.7 billion.

06/01/2015  As the fabless business model has transformed the semiconductor manufacturing landscape, Taiwan and South Korea have undeniably grown into key semiconductor producing regions. However, it should be noted that North America is home to Intel, Texas Instruments, Micron, GLOBALFOUNDRIES, Freescale, Fairchild, Microchip, ON Semiconductor, significant operations of Samsung, and other manufacturers.

05/29/2015  Avago Technologies Limited and Broadcom Corporation today announced that they have entered into a definitive agreement under which Avago will acquire Broadcom in a cash and stock transaction that values the combined company at $77 billion in enterprise value.

05/21/2015  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

05/21/2015  SK Hynix moves into top 5, MediaTek climbs into top 10, and Sharp and UMC move into the top 20 ranking.

05/19/2015  Worldwide silicon wafer area shipments increased during the first quarter 2015 when compared to fourth quarter 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

05/19/2015  Applied Materials, Inc. today announced its Applied Endura Cirrus HTX PVD system with breakthrough technology for patterning copper interconnects at 10nm and beyond.

05/14/2015  There are three main phases to semiconductor manufacturing: research and development (R&D), ramp, and high volume manufacturing (HVM). All of them are expensive and time is a critical element in all three phases.

05/14/2015  Semiconductor Research Corporation (SRC) announced today that Ken Hansen has been appointed SRC’s new President and Chief Executive Officer (CEO), effective June 1.

05/12/2015  JSR Corporation, a materials company and imec, a nanoelectronics R&D center, today signed a Letter of Intent (LOI) to partner in enabling manufacturing and quality control of EUV lithography materials for the semiconductor industry.

05/06/2015  Synthetic diamond heat spreaders and GaN-on-Diamond wafers have emerged as a leading thermal- management technology for RF Power Amplifiers.

05/04/2015  A new study coauthored by Wellesley economist, Professor Daniel E. Sichel, reveals that innovation in an important technology sector is happening faster than experts had previously thought, creating a backdrop for better economic times ahead.

04/28/2015  Brewer Science, Inc., and Nissan Chemical Industries, Ltd., announced they have formally extended their business relationship through 2028.

04/28/2015  Researchers at Columbia Engineering, Harvard, Cornell, University of Minnesota, Yonsei University in Korea, Danish Technical University, and the Japanese National Institute of Materials Science have shown that the performance of another 2D material--molybdenum disulfide (MoS2)--can be similarly improved by BN-encapsulation.

04/27/2015  The decision came after the U.S. Department of Justice (DoJ) advised the parties that the coordinated remedy proposal submitted to all regulators would not be sufficient to replace the competition lost from the merger

04/23/2015  In this 50th year anniversary of Moore’s Law, the steady scaling of silicon chips’ cost and performance that has so changed our world over the last half century is now poised to change it even further through the Internet of Things.

04/22/2015  A book-to-bill of 1.10 means that $110 worth of orders were received for every $100 of product billed for the month.

04/17/2015  Total top 10 marketshare of semiconductor industry now back over 50 percent.

04/16/2015  Today, KLA-Tencor Corporation announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830.