Metrology

METROLOGY ARTICLES



2014 Outlook: An era of unprecedented change

01/24/2014  We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

Moving atomic layer etch from lab to fab

01/23/2014  A new plasma-enhanced atomic layer etch method delivers atomic-level etch precision with process times that are practical for use in a manufacturing environment.

Advances in back-side via etching of SiC for GaN

01/23/2014  The development of an 85µm diameter, 100µm deep SiC back-side via etch process for production is described.

Design for yield trends

01/23/2014  Should foundries establish and share best practices to manage sub-nanometer effects to improve yield and also manufacturability?

SRC launches industry consortium

01/15/2014  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, has launched a significant new initiative on Trustworthy and Secure Semiconductors and Systems (T3S).

Economic recovery and pervasive computing to propel semiconductor manufacturing supply chain

01/14/2014  Macroeconomic and microelectronic industry growth opportunities and innovation challenges underscored diverse perspectives from analysts, economists, technologists, semiconductor manufacturers and supply chain executives speaking at the SEMI Industry Strategy Symposium (ISS) that opened yesterday.

"Crisis? What Crisis?": New paradigm adjustments for capacity and equipment spending

01/09/2014  Worldwide, the semiconductor industry growth rate back in 1973 was about 30 percent and slipped into 1975 with negative sales growth rates.

Book-to-bill: Year-end activity substantially stronger compared to last year

12/20/2013  North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2013 (three-month average basis) and a book-to-bill ratio of 1.11.

Intel ends 2013 with a bang

12/18/2013  ABI Research verified that Intel has a leading position in the mobile processor technology race; launching the first 22nm mobile application processor.

Mindspeed announces agreement to sell assets to Intel

12/16/2013  Mindspeed Technologies, Inc., a supplier of semiconductor solutions for network infrastructure, today announced that it has signed a definitive agreement to sell the assets of its wireless infrastructure business unit to Intel Corporation.

TSI Semiconductors appoints Deborah Harvey as Executive Vice President of Worldwide Foundry Sales

12/13/2013  TSI Semiconductors, LLC, a specialty foundry services company offering flexible technology development and high-quality manufacturing solutions, today announced that Deborah Harvey has joined the company in the newly created position of executive vice president of Worldwide Foundry Sales.

Equipment spending down 2013; expect 33% growth in 2014

12/06/2013  Fab construction projects boom in 2013 but slow in 2014.

Industry on track for highest-ever annual sales in 2013

12/05/2013  Worldwide sales increase for eighth straight month and top $27 billion for first time ever in October; WSTS forecast projects growth of 4.4 percent in 2013 and 4.1 percent in 2014.

Worldwide semiconductor revenue grew 5.2 percent in 2013

12/04/2013  Worldwide semiconductor revenue totaled $315.4 billion in 2013, a 5.2 percent increase from 2012 revenue of $299.9 billion, according to preliminary results by Gartner, Inc.

2013 semiconductor equipment sales forecast $32B; strong growth forecast for 2014

12/03/2013  SEMI projects that worldwide sales of new semiconductor manufacturing equipment will contract 13.3 percent to $32.0 billion in 2013.

Semiconductor Industry Association begins leadership transition

11/27/2013  Semiconductor Industry Association (SIA) president and CEO Brian Toohey has announced his plans to leave the association in 2014 to join New Hampshire-based DEKA Research & Development Corporation as executive vice president.

Above parity: SEMI releases October book-to-bill ratio

11/20/2013  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

Update on 450mm SEMI Standards

11/13/2013  SEMI Standards task forces are working on encouraging the industry to collaborate on key issues like the technical parameters for 450mm silicon wafers, physical interfaces, carriers, assembly and packaging. To date, SEMI has 13 task forces working on 450mm and has published nineteen (19) 450mm standards with 14 more in the pipeline.

SIA awards Mike Splinter the Robert N. Noyce award

11/11/2013  The Semiconductor Industry Association (SIA) today announced that Mike Splinter, former CEO and current executive chairman of the board of directors at Applied Materials, has been named the 2013 recipient of SIA's highest honor, the Robert N. Noyce Award.

Plastic Electronics Conference to rotate between Dresden and Grenoble beginning in 2014

11/07/2013  SEMI, the global trade organization representing the nano- and micro-electronic manufacturing supply chains, today announced that next year’s Plastic Electronics Conference (PE2014) will be held in Grenoble, France and alternate with Dresden, Germany in future years to better address pan-European opportunities and challenges in Plastic Electronics.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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