Metrology

METROLOGY ARTICLES



SK Hynix reports significant process control improvement with new metrology platform

08/12/2013 

Nanometrics Incorporated, a provider of advanced process control metrology and inspection systems, today announced that SK Hynix has reported significant process control improvement by deploying the Atlas II platform for optical critical dimension (OCD) metrology across its memory device production.

IDC forecasts worldwide semiconductor revenue will grow 6.9% in 2013

07/30/2013 

Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).

Rudolph announces new metrology suite for advanced packaging

07/24/2013 

Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its industry-leading NSX 320 Automated Macro Defect Inspection System.

Dialog Semiconductor announces Richard Beyer as new chairman of the board

07/23/2013 

Dialog Semiconductor plc, a provider of highly integrated power management, audio, AC/DC and short-range wireless technologies today announced that Richard Beyer, appointed to the board in February this year, as an independent non-executive director, will succeed Gregorio Reyes as chairman of the board. Greg will continue to serve as a board member.

OEM chip spending returns to growth in 2013

07/22/2013 

After a flat year in 2012, global purchasing of semiconductors by the world’s top electronic brands is set to return to growth in 2013, as Apple Inc. and Samsung Electronics contend to claim the title of biggest spender.

Book-to-bill ratio: Six consecutive months above parity

07/19/2013 

North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in June 2013 (three-month average basis) and a book-to-bill ratio of 1.10.

SRC and Environmental Research Center create new cyclic purge technique

07/16/2013 

Researchers sponsored by Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, today announced that they have developed a more efficient purge technique that reduces the consumption of ultra-high purity (UHP) purge gases by more than 20 percent during the production of semiconductors.

Semiconductor roadmapping update: Front-end technologies – Part 2

07/15/2013 

SEMATECH's Mark Neisser provided a sobering overview of the challenges associated with extending Lithography technology to pattern device structures below a half-pitch of 20nm.

Semiconductor roadmapping update: Front-end technologies Part 1

07/15/2013 

In the afternoon of the last day of SEMICON/West 2013, a session was devoted to updates from the International Technology Roadmap for Semiconductors (ITRS) Front End of Line Technologies.

cyberTECHNOLOGIES introduces Interferometric accuracy on suite of Surface Metrology Systems

07/11/2013 

cyberTECHNOLOGIES GmbH announced the addition of White-Light Interferometry (WLI) to its suite of production-proven CT SERIES non-contact surface metrology systems at SEMICON West 2013.

Boston Semi Equipment announces expansion of front and back end equipment business

07/11/2013 

At SEMICON West 2013, Boston Semi Equipment (BSE), LLC announced the expansion of its semiconductor front end and back end equipment businesses in Tempe, Ariz. into a new and larger facility.

New methods to reduce time and cost of R&D

07/10/2013 

SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to High Volume Manufacturing” held 1:30-3:30PM on July 9.

Toshiba to expand semiconductor fabrication facility

07/03/2013 

Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment and production will reflect market trends.

North American semiconductor equipment industry posts May 2013 book-to-bill ratio

06/21/2013 

A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.

Global semiconductor manufacturing equipment spending to decline in 2013, says Gartner

06/20/2013 

Outlook for semiconductor equipment market improves, but remains soft in the short term.

Semiconductor inventory falls in Q1 as outlook for electronics demand rises

06/20/2013 

Total inventory held by semiconductor suppliers declined significantly in the first quarter as excess stockpiles created during the global economic malaise of 2012 were cleared away, done in anticipation of a resurgence in consumer demand for electronic products expected by the second half of 2013.

SEMATECH names William R. Rozich chairman of the board

06/17/2013 

Rozich, who previously was a member of the company’s board, succeeds Michael R. Polcari, who served as chairman since November 2009.

SEMATECH to address critical supply chain challenges and more at SEMICON West 2013

06/17/2013 

Through a series of lectures and workshops, SEMATECH will address R&D challenges and closing key infrastructure technology gaps from July 8–12 at SEMICON West in San Francisco, CA.

UMC joins IBM chip alliance for 10nm process development

06/13/2013 

IBM and United Microelectronics Corporation, a global semiconductor foundry, today announced that UMC will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.

Fab equipment spending: 23% growth for 2014

06/04/2013 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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