Metrology

METROLOGY ARTICLES



Straatum opens new Silicon Valley office

09/26/2005  September 26, 2005 - Straatum Processware Ltd., a Dublin, Ireland-based supplier of real-time fault detection and classification (FDC) software for semiconductor manufacturing, has opened a global sales office in San Jose, CA.

New insights for Foresight:
A Small Times Q&A with Scott Mize


09/26/2005  The Foresight Nanotech Institute, a public interest think tank with a 20-year history at the forefront of nanotechnology theory, wants to become involved in its more immediate uses as well. Scott Mize was brought on as president a year ago to help execute that transition.

Camtek Rolls Out Three AOI Systems at SEMICON Taiwan

09/13/2005  Migdal Ha'emek, Israel — Camtek Ltd. is introducing three new Falcon wafer AOI system models at SEMICON Taiwan, currently happening from September 12–14 in Taipei. The new models include Falcon 800 for 3-D metrology of gold- and solder-bumped wafers, Falcon 500PD for post-dicing wafer inspection, and Falcon 500 for general wafer inspection before or after test. The Falcon 800 model employs CTS, Camtek's own triangulation height measurement technology — key to its 3-D performance.

AMRC developing nanometrology to probe chip structures at atomic level

08/17/2005  August 17, 2005 - Engineers at Sematech's Advanced Materials Research Center (AMRC), Austin, TX, are investigating a nanoscale approach to metrology that will allow them to examine new semiconductor structures at the atomic level, and so prepare the way for next-generation electronics.

Equipment maker adjusts to lower demand from semi market

07/12/2005  Providers of nanotechnology equipment are retooling their plans in the face of lower demand from semiconductor companies.

Soluris, CEA-Leti form JDP on sub-45nm logic technologies

07/06/2005  July 6, 2005 - Soluris and CEA-Leti have announced that they have engaged a joint development program (JDP) involving Soluris' Yosemite SP-1000 CD-SEM to help characterize the sub-45nm logic technologies at CEA-Leti's new Minatec research facility in Grenoble, France.

July 2005 Exclusive Feature: METROLOGY

Detecting profile excursions using spectroscopic ellipsometry



07/05/2005  By M. Yeh, S.-P. Fang, B.-J. Tsau, C.C. Huang, B. Lin, United Microelectronic Corp.; S. Fu, J. Chen, R. Freed, T. Dziura, M. Slessor, KLA-Tencor Corp.

This work evaluates the capability of a spectroscopic ellipsometry-based profile technology as a new metrology tool to monitor polysilicon gate processes at 130nm and 90nm nodes. This study proves that this method can consistently flag different profile excursions of polysilicon gate.

Rudolph and August sign definitive merger agreement

06/29/2005  June 29, 2005 - Rudolph Technologies Inc. has signed a definitive merger agreement with August Technology Corp. The transaction has been unanimously approved by the board of directors of both companies, is subject to customary regulatory approvals and shareholder vote of each company, and is expected to close in the 4Q05.

Tool companies collaborate on AFM tip development

05/31/2005  Veeco, a developer of atomic force microscopy (AFM) products, announced last week that it signed a joint development program with CEA Leti, an applied research electronics laboratory in Europe, and Team Nanotec, a fabricator of AFM probe tips.

Oraxion Diagnostics appoints new CEO, COO

05/24/2005  May 24, 2005 - Oraxion Diagnostics, a provider of advanced metrology systems, has named industry veterans Bang C. Nguyen as CEO and director and Jonathan M. Sabol as COO.

Distinctive Part Numbers for RoHS-compliant Parts Desired

04/28/2005  (April 28, 2005) Herndon, Va. — The International Electronics Manufacturing Initiative (iNEMI) announces that most of its OEM and EMS members strongly support unique part-number use for RoHS-compliant components, including Alcatel, Celestica, Cray Inc., Dell, Delphi, HP, Intel Corp., Jabil Circuit, Lucent Technologies, Microsoft, Plexus Corp., Sanmina-SCI Corp., Solectron Corp., StorageTek, and Sun Microsystems.

Oregon stays on course despite talk of layoffs at HP

04/20/2005  Oregon's nanotechnology initiative appears to be holding steady even if one of its leading industrial supporters has faced a bumpy start this year. Oregon Nanoscience and Microtechnologies Institute (ONAMI), one of the state's signature research centers, is on the docket for more state and federal funding, and continues to win the support of its business and political leaders.

Sematech identifies top technical challenges for 2006; adds transistor scaling

04/19/2005  April 19, 2005 - Sematech has announced its top technical challenges for 2006, continuing to underscore advanced gate stack, 193nm immersion and EUV lithography, mask infrastructure, and low-k dielectrics with process compatibility. Consortium leaders also placed planar bulk transistor scaling on the list for the first time.




WEBCASTS



Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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