Metrology

METROLOGY ARTICLES



KLA-Tencor announces plans to establish R&D facility in Ann Arbor, Michigan

10/25/2018  KLA-Tencor Corporation has announced plans to establish a research-and-development (R&D) center in Ann Arbor, Michigan.

North American semiconductor equipment industry posts September 2018 billings

10/24/2018  North America-based manufacturers of semiconductor equipment posted $2.09 billion in billings worldwide in September 2018 (three-month average basis), according to the September Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

U.S. announces trade talks with Japan, the EU, and UK; Action will benefit semiconductor industry

10/22/2018  Last week, the Office of the U.S. Trade Representative (USTR), on instruction from President Trump, notified Congress that the administration intends to begin bilateral trade negotiations with Japan, the European Union (EU), and the United Kingdom.

Communications rise to represent largest portion of foundry sales

10/17/2018  Communications apps expected to account for 3x more than computer in 2018 pure-play foundry sales.

SEMI reaffirms support for industry cooperation on RoHS review

10/16/2018  SEMI today confirmed its support for a Joint-Industry Cooperation on an RoHS Review aimed at urging the European Commission to, at a minimum, consider dedicating more resources to a targeted outreach programme with third countries.

Wafer shipments forecast to set new highs through 2021

10/16/2018  Total wafer shipments in 2018 year are expected to eclipse the all-time market high set in 2017 and continue to reach record levels through 2021.

Dynamic Fault Detection: Utilizing AI and IoT to revolutionize manufacturing

10/15/2018  A new approach in Fault Detection and Classification (FDC) allows engineers to uncover issues more thoroughly and accurately by taking advantage of full sensor traces.

Advanced technology key to strong foundry revenue per wafer

10/15/2018  Analysis shows more than a 16x difference between the average revenue generated by 0.5µ 200mm wafers ($370) and ?20nm 300mm wafers ($6,050).

Global semiconductor sales grow as the industry embraces IoT and blockchain technology

10/12/2018  Many semiconductor companies are beginning to embrace IoT to drive new revenue and growth models.

Toshiba Memory Corporation appoints Stacy J. Smith as Executive Chairman

10/11/2018  Toshiba Memory Corporation (TMC) today announced the appointment of Stacy J. Smith as Executive Chairman, effective on October 1, 2018.

The Gigafab Minute and SEMI Standards: A modern miracle

10/09/2018  Even for someone who has been in this industry since the days of the TI Datamath 4-function calculator and the TMS1100 4-bit microcontroller (yes, that’s been a LONG time – the movie Grease premiered the same year!), it is sometimes hard to grasp the scope and complexity of what happens in today’s leading-edge semiconductor gigafabs.

Consumer electronics are fueling global semiconductor market growth

10/04/2018  According to data compiled by Inkwood Research, the global semiconductor market is projected to grow at a CAGR of 7.67% during the forecast period from 2017 to 2024.

DRAM market braces for slower growth

10/03/2018  History suggests that DRAM ASP and market growth will soon trend downward; suppliers cautious and stand ready to adjust capex expansion plans.

SMART Global Holdings appoints semiconductor veteran Bryan Ingram as new independent member of its Board of Directors

10/03/2018  SMART Global Holdings, Inc., parent company of SMART Modular Technologies, Inc. announced the appointment of Bryan Ingram, Senior Vice President and General Manager of the Wireless Semiconductor Division of Broadcom Inc., to its board of directors and its Compensation Committee, effective October 2, 2018.

HEIDENHAIN's new modular angle encoders for semiconductor measurement and metrology

10/02/2018  HEIDENHAIN announces a new series of angle encoders called the ERP 1000 with the design criteria of exceptionally high resolution, high speed, and high contamination resistance.

Global semiconductor sales increase 14.9% year-to-year in August

10/02/2018  Global industry posts highest-ever monthly sales; year-to-year growth seen across all major semiconductor product categories and regional markets.

SEMI Korea Members Day: Takeaways and tech trends as Korea leads in fab investment

09/28/2018  Korea is on track to top all other regions in fab investment, spending $63 billion between 2017 and 2020, with powerhouses Samsung Electronics Co. and SK Hynix leading the way, according to latest World Fab Forecast Report by SEMI.

China forecast to account for 90% of pure-play foundry market growth in 2018

09/26/2018  Driven by cryptocurrency device demand, TSMC's China sales are expected to surge by 79% this year.

China trade brings semiconductor executives to DC for the Fall Washington Forum

09/26/2018  Last week, more than a dozen senior semiconductor executives traveled to Washington, DC for the first-ever Fall Washington Forum.

Semiconductor analyst Mark Lipacis to present featured keynote at GSA Silicon Summit

09/25/2018  Managing Director of Jefferies Group LLC to discuss next semiconductor growth opportunity at October 9 conference, which is designed to advance technology, business and collaboration.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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