05/24/2012 

The 10^th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”

05/24/2012 

Bosch Sensortec has integrated two triaxial MEMS sensors in 1 package, claiming the smallest IMU to date. Solid State Technology spoke with Leopold Beer at Bosch about MEMS integration and the sensor fusion software element of sensing.

05/10/2012 

MEPTEC will host its 10th Annual MEMS Technology Symposium in San Jose, CA. Keynotes cover “sensory swarms” and motion interfaces, and sessions will cover MEMS roadmaps; design, manufacturing, and test of MEMS; MEMS architectures and uses, and more.

05/08/2012 

Si-Ware Systems (SWS) launched its Inertial Sensor Development Platform, the SWS61111, a tool that can be used to evaluate an inertial sensor, such as a gyroscope or accelerometer, to understand sensor behavior and performance with complete interface electronics.

05/02/2012 

Audio Precision released a pulse density modulation (PDM) audio interface option on its APx500 for direct I/O, modulation, and decimation on MEMS microphones and other PDM devices.

04/30/2012 

Contributing editor Steve Groothuis reviews a book titled “Energy Harvesting for Autonomous Systems (Smart Materials, Structures, and Systems).” The book highlights the progression from the basic principles behind energy harvesting to the comprehensive systems that control the sensing, actuation, and transmission of those devices. 

04/26/2012 

The College of Nanoscale Science and Engineering's (CNSE) Smart System Technology and Commercialization Center of Excellence (STC), Canandaigua, NY, was designated as a Trusted Foundry by the US Department of Defense's Defense Microelectronics Agency.

04/23/2012 

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.

04/19/2012 

Silex Microsystems brought its Met-Via full-wafer-thickness TSV technology into Chip Architectures by Joint Associated Labs for European Diagnostics, where it is being used to create cost-effective molded chip-level packaging with through metal vias.

04/13/2012 

04/13/2012 

Blogger Michael A. Fury, Techcet Group, reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the fourth day: nanowire FETs, laminate MEMS, nanoparticles in security printing, graphene nanoribbons, Ta₂O₅ memristors, redox flow batteries, graphene, and more.

04/12/2012 

Blogger Mike Fury reports from the MRS Spring 2012 meeting in San Francisco. Highlights from the third day: leakage and TDDB in low- ? dielectrics, flexible energy storage and conversion, Mn capping layers and diffusion barriers, hard masks for Cu interconnects, nanogenerators, Cu in RF, flexible temperature sensors, NEMS and MEMS in HDD, ZnO nanostructures, and various aspects of CMP.

04/11/2012 

Research and Markets released the "ST L3G3250A 3-axis MEMS Gyroscope Reverse Costing Analysis" report, providing a teardown of STMicroelectronics’ MEMS gyroscope in an LGA package.

04/03/2012 

The MEMS packaging sector is growing 2x faster (~20% CAGR) by unit shipments than the larger IC packaging industry, shows Yole Développement in its report “MEMS Packaging.”

04/02/2012 

Karen Lightman, the Managing Director of the MEMS Industry Group, blogs from the MEMS Executive Congress Europe, which was held March 20th, in Zurich, Switzerland.

03/29/2012 

Microfluidic systems designer and maker Dolomite released Pico-Glide, a surface coating agent that facilitates advanced droplet microfluidics developed by Sphere Fluidics.

03/29/2012 

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.

03/28/2012 

Akustica, known for its monolithic single-chip digital MEMS devices, introduced its first analog 2-chip MEMS microphone for mobile handsets, the AKU340.

03/19/2012 

ACUTRONIC released standard, off-the-shelf 2-axis rate tables to test several MEMS devices simultaneously. The 21-series is primarily made for MEMS manufacturers.

03/14/2012 

Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.