03/13/2012 

iNEMI began 2 collaborative efforts related to micro electro mechanical system (MEMS) technology, specifically reliability and test, and will host a workshop on MEMS in May.

03/12/2012 

Multitest expanded its MEMS portfolio to pick-and-place test applications with the introduction of its test and calibration cart for the MT9510.

03/09/2012 

Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.

03/05/2012 

The CNSE STC, which performs micro electromechanical system (MEMS) and nanotechnology-enabled manufacturing and packaging, successfully completed ISO 9001:2008 registration.

03/01/2012 

After reporting Q4 2011 results, MEMS supplier MEMSIC Inc. (NasdaqGM: MEMS) discussed its 2 main goals for 2012.

02/29/2012 

Nanolab Technologies Incorporated inaugurated its 47,000sq.ft. state-of-the-art facility in Milpitas, CA, more than doubling Nanolab Technologies' space.

02/22/2012 

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.

02/21/2012 

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.

02/17/2012 

At MM/MEMS/NANO Live USA, Professor Yogesh Gianchandani, University of Michigan Wireless Integrated Microsystems and Sensors Center, will keynote the MEMS Commercialization: From Lab to Fab to the Market session.

02/09/2012 

MEMS maker Colibrys SA will relocate locally, to the Y-Parc at Yverdon-les-Bains, Canton Vaud, Switzerland. The new location will enable Colibrys to branch out into new application sectors.

02/08/2012 

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.

02/08/2012 

Si-Ware Systems (SWS) launched a US subsidiary, Si-Ware Systems Inc. Scott Smyser, a new EVP for worldwide marketing and business development, will manage the US business.

02/06/2012 

Nextreme Thermal Solutions announced that its thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with the performance of bulk thermoelectric technology.

02/03/2012 

X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18

02/02/2012 

Qualtré, silicon MEMS inertial sensors developer, appointed Dr. Ijaz Jafri as VP of engineering, responsible for all aspects of product development and commercialization. Jafri has 16+ years of experience in MEMS and semiconductors.

02/02/2012 

3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).

01/31/2012 

Audio test tool supplier Audio Precision launched the PDM I/O option for its APx500 series audio analyzers, used to test digital micro electro mechanical system (MEMS) microphones.

01/25/2012 

SCHOTT North America Inc. introduced MEMpax borosilicate glass for use in MEMS manufacturing, available in thicknesses from 1.1 to 0.1mm and with a CTE corresponding to Si.

01/25/2012 

2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.

01/24/2012 

Si-Ware Systems debuted the SiMOST platform to fab and package single-chip optical systems with validated MEMS components. Multiple MOEMS structures can be patterned and etched on SOI wafers using DRIE. The structures are then wafer-level packaged and diced.