Packaging and Testing

PACKAGING AND TESTING ARTICLES



Silex devs wafer-level MEMS fab technologies for mobile devices

01/23/2012 

Silex Microsystems joined Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices to develop TSVs, PZT thin films, and other technologies for high-performance RF systems targeting mobile devices.

Present at MEMS and nano manufacturing conferences in the UK

01/20/2012 

MM, MEMS & NANO Live UK 2012 will take place at NEC Birmingham, UK, September 25-26, co-located with TCT Live, Mediplas, and Sensing Technology 2012.. Submit an abstract by February 28.

MEMS panel, tablet teardown, smart grid talk highlights of upcoming Sensors in Design

01/19/2012 

Sensors in Design 2012 takes place March 28-29 in San Jose, CA. With speakers from Texas Instruments and Intel, InvenSense, Analog Devices, and more, the event is designed for attendees to better understand sensor technologies and their applications.

Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop

01/18/2012 

Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding for RF and Microwave Devices" at the Advanced Technology Workshop and Tabletop Exhibition on RF and Microwave Packaging

Norcada microporous silicon nitride sample holders suit thin film study

01/17/2012 

Norcada launched 2 microporous silicon nitride TEM sample holders, suiting ALD analysis, thin film growth, and other applications under TEM, SEM, or STXM tools.

Baolab intros eval kits for CMOS-integrated MEMS tech

01/16/2012 

Baolab Microsystems is launching evaluation kits of its 3D CMOS MEMS NanoCompass technology. Baolab's NanoEMS technology creates nanoscale MEMS within the standard metal structure of a high-volume-manufactured CMOS wafer.

Multitest ships first MEMS MT9510 test tool to US IDM

01/12/2012 

Multitest shipped the first Multitest MEMS equipment for the MT9510 pick-and-place test handler to an IDM in the US. The IDM will perform MEMS gyroscope test on the newly installed tool.

NXP MEMS frequency synthesizer debuts at CES

01/10/2012 

NXP Semiconductors unveiled an ultra-compact, high-precision MEMS-based frequency synthesizer, which challenges quartz-crystal-based devices for the timing market. The die is packaged with IC components in a standard, low-cost plastic package.

Fraunhofer micro-scanner MEMS eval kit now configurable online

01/06/2012 

Fraunhofer Institute for Photonic Microsystems IPMS has placed its Light Deflection Cube evaluation kit custom-configuration and ordering on the Internet. The LDC is used to evaluate single-axis MEMS scanning mirrors.

MEMS sensors in integrated smart systems

01/04/2012 

Embedded features and sensor integration will determine the future applications of MEMS sensors. Jay Esfandyari et al, STMicroelectronics, share an overview of future trends of sensor integration -- sensor fusion -- and some of the features available today in digital MEMS inertial sensors.

JCAP, Enpirion partner on MEMS manufacturing

01/03/2012 

Enpirion, Inc. entered into a strategic partnership agreement with JiangyinChangdian Advanced Packaging Co., Ltd. (JCAP) for the manufacturing of silicon-based magnetics utilizing Enpirion's proprietary micro electronic magnetic silicon (MEMS) technology.

MEMS die size grows, test evolves, and other trends

12/26/2011 

Yole studies the evolution of inertial MEMS and magnetometers and provides reverse costing analysis of the MEMS devices in "Technology Trends for Inertial MEMS." The report considers 23 MEMS devices.

inTEST to acquire Thermonics division of Test Enterprises

12/13/2011 

inTEST will acquire the assets and certain liabilities of Thermonics from Test Enerprises. inTEST's Temptronic Corporation, of the Thermal Solutions Group, will integrate the company.

Tronics wins MEMS fab contract from DelfMEMS

12/13/2011 

DelfMEMS SA named Tronics as its micro electro mechanical systems (MEMS) foundry partner. Tronics will manufacture RF MEMS switches for DelfMEMS, with high-capacity runs starting in 2012.

imec presents MEMS energy harvester at IEDM

12/08/2011 

Imec and Holst Centre micromachined a vibration-energy harvester with 489µW output power, using piezoelectric material in a MEMS cantilever. The team presented results at IEEE's International Electron Devices Meeting (IEDM) this week in Washington DC.

AFM images MEMS structures with quantitative measurements

12/08/2011 

JPK Instruments introduced QI, or quantitative imaging mode, for the recently launched NanoWizard3 AFM analytical system. QI enables full control of tip-sample force at every pixel.

Cornell, SRC develop RF MEMS technologies

12/07/2011 

Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, is working with Cornell University researchers to develop on-chip silicon technologies for mobile devices. The aim is a micro-mechanical resonator for RF MEMS.

Silicon interposer partnership sets roadmap

12/06/2011 

Singapore's A*STAR IME and 3D IC developer Tezzaron Semiconductor signed a research collaboration agreement to develop and exploit advanced through silicon interposer (TSI) technology.

IDT MEMS oscillator commercializes piezoelectric resonators

11/30/2011 

Integrated Device Technology, Inc. (IDT, NASDAQ:IDTI) developed and demonstrated commercially available oscillators incorporating piezoelectric micro electro mechanical system (pMEMS) resonators.

SUSS MicroTec partners for health research

11/25/2011 

SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor industry and related markets, announces the cooperation with Swansea University´s Centre for NanoHealth (CNH).




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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