Packaging and Testing

PACKAGING AND TESTING ARTICLES



Magnetic sensor industry is moving into a consolidation phase

11/13/2017  With 7% CAGR between 2016 and 2022, the magnetic sensor market should reach almost US$ 2.5 billion in 2022.

Leti joins DARPA-funded consortium to develop implantable device for restoring vision

11/09/2017  Leti announced today that a team of its researchers is participating in a U.S.-funded project to develop a safe, implantable neural interface system to restore vision by stimulating the visual cortex.

The intelligence that leads to artificial intelligence

11/08/2017  Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding.

2017 sees advances in connected devices, memory

11/07/2017  The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.

MEMS & sensors safeguard autonomous cars, boost agricultural productivity and anticipate needs

11/03/2017  MEMS & Sensors Executive Congress speakers feature smart sensing components in new industrial, automotive, biomedical, agricultural applications.

The MEMS packaging market is growing faster than the devices market itself

10/30/2017  The MEMS packaging market’s value is growing faster than the MEMS device market’s value: respectively, a 16.7% CAGR for packaging versus 14.1% for devices, during the period 2016 - 2022.

Optoelectronics, sensors/actuators and discretes climb

10/30/2017  The O-S-D market segments are growing at above average rates in 2017 and all three are expected to reach new record highs for the first time in six years, says new update.

Number of connected IoT devices will surge to 125 billion by 2030

10/27/2017  The number of connected Internet of Things (IoT) devices worldwide will jump 12 percent on average annually, from nearly 27 billion in 2017 to 125 billion in 2030, according to new analysis from IHS Markit.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

MEMS & sensors companies compete for tech showcase "crown"

10/05/2017  MSIG announces five finalists for Technology Showcase at MEMS & Sensors Executive Congress, November 1-2, in Napa Valley, Calif.

Comet Group to open Silicon Valley office

10/03/2017  COMET Group today announced the opening of Lab One, its customer-centric technology and application center in San Jose, CA.

Robotics and chip industries in Japan

10/02/2017  Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

TowerJazz and Crocus expand presence in magnetic sensors market

09/27/2017  Crocus TMR sensors offer important advantages for multiple applications in IoT, consumer, automotive, industrial and medical sectors.

Wearable sensors reach their first billion-dollar year, with growth coming in three waves

09/27/2017  IDTechEx predict that 2017 will be the first billion dollar year for wearable sensors.

North American semiconductor equipment industry posts August 2017 billings 

09/22/2017  Equipment billings in August declined relative to July, signaling a pause in this year's extraordinary growth.

Leti develops proof of concept to test wireless systems in aircraft

09/20/2017  Leti, a technology research institute of CEA Tech, announced today it has developed a methodology for testing high-speed wireless communications on airplanes that allows different system deployments in cabins, and assesses wireless devices before they are installed.

MEMS & Sensors Executive Congress answers "What's driving $66B industry?"

09/06/2017  Speakers to explore biomedical, automotive, agriculture and smart home, November 1-2 in Napa Valley, Calif.

Technology Showcase finalists revealed for European MEMS & Sensors Summit

08/29/2017  Five companies compete for attendee votes at SEMI European MEMS & Sensors Summit, September 20-22, 2017, Grenoble, France.

Automotive sensing: A mature yet highly dynamic market

08/29/2017  Despite its age and maturity, the automotive market has witnessed many unexpected developments over the past two years. And as has always been the case, safety drives the market.

Large wafers, complex IC designs among advanced packaging trends

08/15/2017  The global semiconductor advanced packaging market is expected to grow at a CAGR of 8.45% during the period 2017-2021, according to Research and Markets.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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