11/05/2015  With the emergence of the IoT (Internet of Things), advanced packaging is clearly the enabling technology providing solutions for mobile applications and for semiconductor devices fabricated at 16 nm and below process nodes.

11/03/2015  FEI Company and DCG Systems, Inc. announced an agreement where FEI willacquire DCG for $160 million in an all cash transaction.

11/03/2015  DCG Systems announced the release of EBIRCH, a technology for localizing shorts and other low-resistance faults that may reside in the interconnect structures or the polysilicon base layer of integrated circuits.

11/03/2015  Plasma-Therm announced that it has acquired a High Density Radical Flux plasma technology that enables low-temperature Bosch polymer removal.

10/22/2015  A report that resulted from a workshop funded by Semiconductor Research Corporation and National Science Foundation outlines key factors limiting progress in computing and novel device and architecture research that can overcome these barriers.

10/20/2015  An advance look at some of the most newsworthy topics and papers that will be presented at this year's IEEE International Electron Devices Meeting.

10/19/2015  Siborg has recently made a new MicroTec version available particularly targeting educational use of the software.

10/19/2015  Applied Materials, Inc. announced it plans to establish a new R&D laboratory in Singapore in collaboration with the Agency for Science, Technology and Research (A*STAR).

10/02/2015  Yamaichi Electronics presents Test Contactors for lab and reliability applications and ultra fine pitch semiconductor devices.

09/29/2015  D2S announced that it has partnered with Advantest to integrate D2S' Wafer Plane Analysis engine into Advantest's Mask MVM-SEM (Multi Vision Metrology Scanning Electron Microscope) systems.

09/28/2015  The official Call for Papers has been issued for the 2016 Symposia on VLSI Technology and Circuits, to be held at the Hilton Hawaiian Village June 13-16, 2016 (Technology) and June 15-17, 2016 (Circuits).

09/28/2015  Tektronix, Inc. today announced the expansion of its DPO70000SX Performance Oscilloscope Series to include 50 GHz and 23 GHz models.

09/18/2015  This is the ninth in a series of 10 installments that explore certain fundamental truths about process control--defect inspection and metrology--for the semiconductor industry.

09/03/2015  SEMI’s European MEMS Summit will be held on 17-18 September 2015 in Milan, Italy. Over the course of the two-day event, more than 20 keynote and invited speakers from the entire supply chain will share their perspectives and latest updates, including participation by European MEMS leaders. In addition, a focused industry exhibition will complement the conferences offering with additional networking opportunities.

09/02/2015  Milestone confirmed by groundbreaking new data; bi-directional incremental capability allows startup to leapfrog IBM and other established competitors in emerging computing fields.

08/25/2015  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, will host a special session at the 41st Micro and Nano Engineering (MNE 2015) conference.

08/25/2015  As Bosch, InvenSense and STMicroelectronics continue to go head-to-head in an attempt to capture the biggest shares of the growing MEMS market, SEMI has announced that it will bring these MEMS giants together in an unprecedented European conference & exhibition to discuss the future of MEMS and Sensors.

08/18/2015  MEMS Industry Group (MIG)'s next MEMS Executive Congress US 2015 will explore the market drivers behind the double-digit growth propelling MEMS and sensors to more than $20+ billion by 2020.

08/11/2015  Leading industry experts participated in the joint SEMI-MEMS Industry Group (MIG) workshop during SEMICON West 2015 to discuss industry challenges – and potential solutions and collaborative approaches – in the MEMS, sensors and semiconductor industries.

08/04/2015  MEMS Industry Group (MIG) will gather the world’s leading providers of micro-electromechanical systems (MEMS) and sensors technology for its second annual MEMS Industry Group Conference Asia in Shanghai, China on September 8-11, 2015.