Packaging Materials

PACKAGING MATERIALS ARTICLES



U.S. semiconductor chemical suppliers lost market share over past decade

11/10/2017  U.S. semiconductor chemical suppliers lost market share to Japanese and European competitors in every major segment over the past decade, according to a new report from The Information Network.

Third quarter 2017 silicon wafer shipments hit another quarterly record

11/08/2017  Worldwide silicon wafer area shipments increased during the third quarter 2017 when compared to second quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

How to solve the BEOL RC delay problem?

11/07/2017  The RC delay issues started a few nodes ago, and the problems are becoming worse.

Lightning-fast communications

11/06/2017  University of Utah researchers develop milestone for ultra-fast communications and computing.

Global semiconductor industry posts highest-ever quarterly sales

11/01/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter.

NREL research yields significant thermoelectric performance

11/01/2017  Addition of thin films to fabrics could power portable electronics, sensors.

Deep-depletion: A new concept for MOSFETs

10/26/2017  An international team of researchers has created a proof of concept that uses the deep-depletion regime in bulk-boron-doped diamond MOSFETs to increase hole channel carrier mobility.

Nanotube fiber antennas as capable as copper

10/23/2017  Rice University researchers show their flexible fibers work well but weigh much less.

Strong solar and semiconductor demand but still a sizeable oversupply of polysilicon

10/18/2017  An oversupply of polysilicon will double in 2018 despite strong demand in solar and semiconductor markets, according to a report recently published by The Information Network.

Long nanotubes make strong fibers

10/17/2017  Rice University researchers advance characterization, purification of nanotube wires and films.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

China IC industry outlook

10/17/2017  With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.

Paper-based supercapacitor uses metal nanoparticles to boost energy density

10/10/2017  Using a simple layer-by-layer coating technique, researchers from the U.S. and Korea have developed a paper-based flexible supercapacitor that could be used to help power wearable devices.

Prototype shows how tiny photodetectors can double their efficiency

10/09/2017  UC Riverside research invokes quantum mechanical processes that occur when two atomically thin materials are stacked together.

WIN Semiconductors enhances 0.25µm GaN power process

10/09/2017  The NP25 technology provides 28-volt operation with superior power density and efficiency for demanding power applications through Ku-band.

Tungsten offers nano-interconnects a path of least resistance

10/05/2017  Crystalline tungsten shows insight and promise in addressing the challenges of electrical interconnects that have high resistivity at the nanoscale.

A sea of spinning electrons

10/03/2017  Rutgers-led discovery could spawn a wave of new electronic devices.

Graphene forged into three-dimensional shapes

09/26/2017  Researchers from Finland and Taiwan have discovered how graphene, a single-atom-thin layer of carbon, can be forged into three-dimensional objects by using laser light. A striking illustration was provided when the researchers fabricated a pyramid with a height of 60nm, which is about 200 times larger than the thickness of a graphene sheet.

Laser marking meets diverse challenges in fab and packaging

09/22/2017  The basics of laser marking are reviewed, as well as current and emerging laser technologies.

Application of air-sensitive semiconductors in nanoelectronics

09/21/2017  2-D semiconductor gallium selenide in encapsulated nanoelectronic devices.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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