Packaging Materials

PACKAGING MATERIALS ARTICLES



iPhone 7 materials costs higher than previous versions

09/22/2016  The bill of materials (BOM) for an iPhone 7 equipped with 32 gigabytes (GB) of NAND flash memory carries $219.80 in bill of materials costs, according to a preliminary estimate from IHS Markit.

Solid State Technology announces expanded conference for The ConFab 2017

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

Tuning materials and devices to adapt to their environment

09/13/2016  University of California, Santa Barbara researchers pursue future radio-frequency materials and devices.

Semiconducting inorganic double helix

09/12/2016  New flexible semiconductor for electronics, solar technology and photo catalysis.

Silicon nanoparticles instead of expensive semiconductors

09/09/2016  Within an international collaboration, physicists of the Moscow State University replace expensive semiconductors with affordable silicon nanoparticles for display production.

For first time, carbon nanotube transistors outperform silicon

09/06/2016  For the first time, University of Wisconsin-Madison materials engineers have created carbon nanotube transistors that outperform state-of-the-art silicon transistors.

Iowa State engineers treat printed graphene with lasers to enable paper electronics

09/02/2016  Iowa State engineers have led development of a laser-treatment process that allows them to use printed graphene for electric circuits and electrodes -- even on paper and other fragile surfaces. The technology could lead to many real-world, low-cost applications for printed graphene electronics, including sensors, fuel cells and medical devices.

UCF team tricks solid into acting as liquid

09/01/2016  Two scientists at the University of Central Florida have discovered how to get a solid material to act like a liquid without actually turning it into liquid, potentially opening a new world of possibilities for the electronic, optics and computing industries.

Hexagonal boron nitride semiconductors enable cost-effective detection of neutron signals

08/16/2016  Texas Tech University researchers demonstrate hexagonal boron nitride semiconductors as a cost-effective alternative for inspecting overseas cargo containers entering US ports.

Extending tungsten metallization for next-generation devices

08/15/2016  Recent breakthroughs in materials engineering of low-resistance W barriers/liners and bulk fill are making it possible to extend W use to next-generation devices.

Transmitting energy in soft materials

08/09/2016  A new way to send mechanical signals through soft materials.

Smarter self-assembly opens new pathways for nanotechnology

08/08/2016  To continue advancing, next-generation electronic devices must fully exploit the nanoscale, where materials span just billionths of a meter. But balancing complexity, precision, and manufacturing scalability on such fantastically small scales is inevitably difficult.

Carbon nanotube 'stitches' make stronger, lighter composites

08/03/2016  Method to reinforce these materials could help make airplane frames lighter, more damage-resistant.

New nontoxic process promises larger ultrathin sheets of 2-D nanomaterials

07/27/2016  A team of scientists led by the Department of Energy's Oak Ridge National Laboratory has developed a novel way to produce two-dimensional nanosheets by separating bulk materials with nontoxic liquid nitrogen.

Utah and Minnesota engineers discover highly conductive materials for more efficient electronics

07/27/2016  Engineers from the University of Utah and the University of Minnesota have discovered that interfacing two particular oxide-based materials makes them highly conductive, a boon for future electronics that could result in much more power-efficient laptops, electric cars and home appliances that also don't need cumbersome power supplies.

Evolving flip-chip technology boosting markets

07/25/2016  New levels of performance of electronics technology have been enabled by flip-chip technology, fueling the growth of global markets for semiconductors, electronic devices, and a host of industrial and consumer products.

Quantum drag

07/20/2016  University of Iowa physicist says current in one iron magnetic sheet can create quantized spin waves in another, separate sheet.

Graphene photodetectors: Thinking outside the 2-D box

07/18/2016  The efficient detection of low-energy photons constitutes one of the main challenges faced by future optoelectronics. Finding new ways of sensing and harvesting these photons is crucial for the development of technologies such as silicon photonics, pollution sensing and next-generation solar.

Imec and Synopsys collaborate on interconnect resistivity model

07/11/2016  Synopsys' Process Explorer and Raphael accurately simulate parasitic resistance of alternative metals and liner-barrier materials at the 7nm node and beyond.

AMICRA to provide precision die attach system to Fabrinet in Silicon Valley

07/01/2016  AMICRA Microtechnologies, a German-based vendor of advanced back-end assembly processing equipment for advanced packaging applications, has received an order for the AFC Plus System from Fabrinet West.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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