03/01/2019  A structure comprising a molybdenum disulfide monolayer on an azobenzene substrate could be used to build a highly compactable and malleable quasi-two-dimensional transistor powered by light.

03/01/2019  A research team at Tokyo Tech's Department of Materials Science and Engineering including Tsuyoshi Michinobu and Yang Wang report a way of increasing the electron mobility of semiconducting polymers, which have previously proven difficult to optimize.

02/28/2019  A structure comprising a molybdenum disulfide monolayer on an azobenzene substrate could be used to build a highly compactable and malleable quasi-two-dimensional transistor powered by light.

02/26/2019  Scientists create a unique platform to study quantum optical physics on the nanoscale.

02/25/2019  University of Manchester researchers have observed an unusual quantum Hall effect in the old three-dimensional material.

02/25/2019  Ferroic and multiferroic topological structures reviewed in Nature Materials.

02/21/2019  Researchers from EPFL's Laboratory of Semiconductor Materials, run by Anna Fontcuberta i Morral, together with colleagues from MIT and the IOFFE Institute, have come up with a way of growing nanowire networks in a highly controlled and fully reproducible manner.

02/15/2019  Switching superferromagnetism with electric-field induced strain.

02/14/2019  Organic semiconductors are lightweight, flexible and easy to manufacture. But they often fail to meet expectations regarding efficiency and stability. Researchers at the Technical University of Munich (TUM) are now deploying data mining approaches to identify promising organic compounds for the electronics of the future.

02/11/2019  The EPFL's School of Engineering method produces dielectric glass metasurfaces that can be either rigid or flexible. The results of their research appear in Nature Nanotechnology.

02/07/2019  Germanene is a 2D material that derives from germanium and is related to graphene. As it is not stable outside the vacuum chambers in which is it produced, no real measurements of its electronic properties have been made. Scientists led by Prof. Justin Ye of the University of Groningen have now managed to produce devices with stable germanene.

02/05/2019  Researchers from the University of Houston have reported significant advances in stretchable electronics, moving the field closer to commercialization.

02/04/2019  Electronics industry veteran succeeds founding CEO Peter Kallai as organization shifts head office from Ottawa to GTA.

02/01/2019  For the first time, a team of researchers has demonstrated that laser-generated crystals confined in glass retain controllable ferroelectric properties, key to creating faster, more efficient optical communication systems.

01/31/2019  Water molecules distort the electrical resistance of graphene, but a team of European researchers has discovered that when this two-dimensional material is integrated with the metal of a circuit, contact resistance is not impaired by humidity. This finding will help to develop new sensors -the interface between circuits and the real world- with a significant cost reduction.

01/31/2019  Researchers from the Dresden Integrated Center for Applied Physics and Photonic Materials (IAPP) and the Center for Advancing Electronics Dresden (cfaed) at TU Dresden, in cooperation with Stanford University (USA) and the Institute for Molecular Science in Okazaki (Japan), have identified the key parameters that influence electrical conductivity in doped organic conductors.

01/25/2019  Laser systems specialist LPKF Laser & Electronics, based in Hannover, Germany has added a foundry service for thin glass substrates to its product portfolio.

01/23/2019  New printing technique and materials could be used to develop intelligent materials and self-adaptive infrastructures and transducers.

01/22/2019  SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus.

01/22/2019  Corning Incorporated today introduced its latest breakthrough in glass substrates for the semiconductor industry – Advanced Packaging Carriers.