Packaging Materials


Hybrid material may outperform graphene in several applications

03/01/2019  A structure comprising a molybdenum disulfide monolayer on an azobenzene substrate could be used to build a highly compactable and malleable quasi-two-dimensional transistor powered by light.

Organic electronics: Scientists develop a high-performance unipolar n-type thin-film transistor

03/01/2019  A research team at Tokyo Tech's Department of Materials Science and Engineering including Tsuyoshi Michinobu and Yang Wang report a way of increasing the electron mobility of semiconducting polymers, which have previously proven difficult to optimize.

Hybrid material may outperform graphene in several applications

02/28/2019  A structure comprising a molybdenum disulfide monolayer on an azobenzene substrate could be used to build a highly compactable and malleable quasi-two-dimensional transistor powered by light.

It's all in the twist: Physicists stack 2D materials at angles to trap particles

02/26/2019  Scientists create a unique platform to study quantum optical physics on the nanoscale.

Graphite offers up new quantum surprise

02/25/2019  University of Manchester researchers have observed an unusual quantum Hall effect in the old three-dimensional material.

Topological defects could be key to future nano-electronics

02/25/2019  Ferroic and multiferroic topological structures reviewed in Nature Materials.

The holy grail of nanowire production

02/21/2019  Researchers from EPFL's Laboratory of Semiconductor Materials, run by Anna Fontcuberta i Morral, together with colleagues from MIT and the IOFFE Institute, have come up with a way of growing nanowire networks in a highly controlled and fully reproducible manner.

Spintronics by 'straintronics'

02/15/2019  Switching superferromagnetism with electric-field induced strain.

Chemical data mining boosts search for new organic semiconductors

02/14/2019  Organic semiconductors are lightweight, flexible and easy to manufacture. But they often fail to meet expectations regarding efficiency and stability. Researchers at the Technical University of Munich (TUM) are now deploying data mining approaches to identify promising organic compounds for the electronics of the future.

Next-generation optics in just two minutes of cooking time

02/11/2019  The EPFL's School of Engineering method produces dielectric glass metasurfaces that can be either rigid or flexible. The results of their research appear in Nature Nanotechnology.

First transport measurements reveal intriguing properties of germanene

02/07/2019  Germanene is a 2D material that derives from germanium and is related to graphene. As it is not stable outside the vacuum chambers in which is it produced, no real measurements of its electronic properties have been made. Scientists led by Prof. Justin Ye of the University of Groningen have now managed to produce devices with stable germanene.

Researchers report advances in stretchable semiconductors, integrated electronics

02/05/2019  Researchers from the University of Houston have reported significant advances in stretchable electronics, moving the field closer to commercialization.

Mark Majewski named new intelliFLEX CEO

02/04/2019  Electronics industry veteran succeeds founding CEO Peter Kallai as organization shifts head office from Ottawa to GTA.

Laser-fabricated crystals in glass are ferroelectric

02/01/2019  For the first time, a team of researchers has demonstrated that laser-generated crystals confined in glass retain controllable ferroelectric properties, key to creating faster, more efficient optical communication systems.

Waterproof graphene electronic circuits

01/31/2019  Water molecules distort the electrical resistance of graphene, but a team of European researchers has discovered that when this two-dimensional material is integrated with the metal of a circuit, contact resistance is not impaired by humidity. This finding will help to develop new sensors -the interface between circuits and the real world- with a significant cost reduction.

Researchers at TU Dresden decipher electrical conductivity in doped organic semiconductors

01/31/2019  Researchers from the Dresden Integrated Center for Applied Physics and Photonic Materials (IAPP) and the Center for Advancing Electronics Dresden (cfaed) at TU Dresden, in cooperation with Stanford University (USA) and the Institute for Molecular Science in Okazaki (Japan), have identified the key parameters that influence electrical conductivity in doped organic conductors.

LPKF offers glass foundry service for advanced IC and MEMS packaging solutions

01/25/2019  Laser systems specialist LPKF Laser & Electronics, based in Hannover, Germany has added a foundry service for thin glass substrates to its product portfolio.

Mechanical engineers develop process to 3D print piezoelectric materials

01/23/2019  New printing technique and materials could be used to develop intelligent materials and self-adaptive infrastructures and transducers.

Agile manufacturing of glass carriers for advanced packaging

01/22/2019  SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus.

Corning Precision Glass Solutions introduces advanced packaging carriers optimized for fan-out processes

01/22/2019  Corning Incorporated today introduced its latest breakthrough in glass substrates for the semiconductor industry – Advanced Packaging Carriers.


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts