01/25/2019  Alliance Memory today announced that it is offering several end-of-life 8G DDR3L SDRAMs for which Micron Technology Inc.

01/23/2019  ZEISS today unveiled a new suite of high-resolution 3D X-ray imaging solutions for failure analysis (FA) of advanced semiconductor packages, including 2.5/3D and fan-out wafer-level packages.

01/22/2019  SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus.

01/22/2019  Corning Incorporated today introduced its latest breakthrough in glass substrates for the semiconductor industry – Advanced Packaging Carriers.

01/22/2019  Soitec (Euronext Paris), a designer and manufacturer of innovative semiconductor materials, announced today an expanded collaboration with Samsung Foundry to ensure the volume supply of fully depleted silicon-on-insulator (FD-SOI) wafers.

01/18/2019  Constant coverage of an invigorating topic like machine intelligence in the media often urges us to consider its use in EDA technology.

01/17/2019  2018 semiconductor M&A valued at $23.2 billion, down from the record $107.3 billion in 2015.

01/17/2019  Rambus Inc. today announced it has acquired the assets of Diablo Technologies to broaden its portfolio in the hybrid DRAM and Flash memory markets.

01/15/2019  Process control systems used for advanced packaging of DRAM products in Korea and China facilities; additional orders expected to meet capacity ramp.

01/14/2019  SEMI Taiwan Testing Committee founded to strengthen the last line of defense to ensure the reliability of advanced semiconductor applications.

01/11/2019  2019 to be third year of greater than $25.0B in spending for flash, topping both DRAM, foundry.

01/10/2019  SEMI met with Dr. Jose Pozo, director of Technology and Innovation at EPIC (European Photonics Industry Consortium), to discuss how 3D packaging applications and heterogeneous integration trends are shaping the European technology landscape.

01/08/2019  One quarter after release, the new Dragonfly platform achieves market recognition in advanced macro inspection with multiple deliveries to world’s largest OSAT.

12/21/2018  Intevac, Inc. announced today it has received multiple new program awards that together increase Photonics backlog by over $35 million, to an expected five-year record level at year-end 2018.

12/20/2018  Today, it is crystal-clear that, from theoretical point of view, GaN offers fantastic technical advantages over traditional Si MOSFETs.

12/18/2018  Researchers at the University of Florida, the U.S. Naval Research Laboratory and Korea University provide a detailed perspective on the properties, capabilities, current limitations and future developments for one of the most promising UWB compounds, gallium oxide.

12/17/2018  JEDEC Solid State Technology Association announced the publication of an update to JESD235 High Bandwidth Memory (HBM) DRAM standard.

12/13/2018  Panel FO-WLP is in production at Powertech Technology, Inc. (PTI) for MediaTek’s power management integrated circuit (PMIC) for smartphone applications.

12/12/2018  Now that most companies in our sector analyses have reported their calendar third quarter 2018 financial results, we have final or 3Q'18/2Q'17 growth estimates for the world electronic supply chain.

12/11/2018  Lattice Semiconductor Corporation announced the appointment of Glenn O’Rourke as the Company’s Corporate Vice President, Global Operations, effective immediately.