Packaging

PACKAGING ARTICLES


SUSS buys Tamarack for lithography, laser structuring lines

03/30/2012 

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.
Semiconductor wafer fab utilization rates bucked expectations in late 2011

03/29/2012 

The Global Semiconductor Alliance (GSA) released its GSA Q1 Wafer Fabrication & Back-End Pricing Reports, tracking fab utilization rates, wafer and mask costs, and package pricing.
Field Report: Sensors in Design 2012

03/29/2012 

Sensors in Design 2012 was opened March 28 at the San Jose McEnery Convention Center, in conjunction with Design West. Blogger Mike Fury reports.

Cypress Semiconductor transfers back-end packaging lines to China

03/27/2012 

Cypress Semiconductor transferred 7 back-end semiconductor package assembly lines from its Philippines facility to Chinese packaging subcontractor Jiangsu Changjiang Electronics Technology Co.
High voltage SourceMeter introduced

03/27/2012 

Glass-coated bonding wire targets copper, small diameter market

03/27/2012 

RED Micro Wire (RWM), a subsidiary of RED Equipment, announced a new high-quality copper wire featuring glass insulation for use in semiconductor wire bonding.
TI adds bare die to small-quantity semiconductor packaging options

03/27/2012 

Texas Instruments Incorporated (TI, TXN) now offers bare die in quantities as low as 10 pieces for initial prototyping, and larger quantities (full waffle trays) for production volumes.
Applied Materials analyst day preview

03/26/2012 

Applied Materials will host its annual Analyst meeting this week (March 28). Barclays Capital shares its expectations for AMAT's update and the wafer fab equipment (WFE) outlook in general.
OSAT provider orders wafer inspection tools from Camtek

03/26/2012 

Camtek Ltd. sold $3.5 million of Falcon inspection tools to a global outsourced semiconductor assembly and test (OSAT) provider, for various applications in the backend assembly process.
Synopsys launches 3D packaging EDA line-up

03/26/2012 

Synopsys is combining several products into a 3D-IC initiative for semiconductor designers moving to stacked-die silicon systems in 3D packaging. The 3D-IC initiative will bring in leading IC design and manufacturing companies to work with Synopsys on a comprehensive EDA solution.
Imec ultrathin chip packaging yields improved

03/23/2012 

Research organization imec introduces important changes to its ultrathin chip packaging (UTCP) technology, increasing yields 15-20%.
SEMICON Europa 2012 seeks presenters

03/23/2012 

SEMI is seeking papers for technical sessions and presentations at the upcoming SEMICON Europa 2012, October 9-11 in Dresden, Germany. Technical presentation abstracts are due April 30.
Keithley power semiconductor tester uses 3000V source

03/23/2012 

Keithley Instruments introduced the Model 2657A High Power System SourceMeter instrument, adding high voltage test to its line of high-speed, precision source measurement units for power semiconductors.
Texas Instruments (TI) embedded die package teardown report released

03/22/2012 

Texas Instruments' MicroSiP module is the first embedded die package in high volume production. Yole D
DOW opens semiconductor/display R&D center in Seoul with OLED focus

03/22/2012 

The Dow Chemical Company (NYSE: DOW) inaugurated its Dow Seoul Technology Center, a global R&D center with focus on technological advances in display and semiconductor applications.
Apple A5X processor teardown: Bigger die, higher heat?

03/22/2012 

Apple’s ARM-based processors have created a point of hardware differentiation in applications processors. With the A5X, Apple is going with a much larger die at the 45nm node (shared across the 2 prior generations), shares Chipworks. It's also turned off the PoP track.
Taiwan allows higher Chinese investments in LCDs, semiconductors, fab equipment, more

03/21/2012 

Taiwan raised investment ceilings for Chinese investors in LCDs, semiconductors, IC assembly and test, microelectronics production equipment, and metal tool manufacturing.
Semiconductor capex to fall 11.6% in 2012, says Gartner

03/21/2012 

Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner Inc.
Altera taps Amkor for molded flip chip packaging of FPGA family

03/21/2012 

Altera Corporation will use an exposed-die molded flip chip technology from Amkor on its 28nm Arria V FPGA. Amkor
Fraunhofer delivers 300mm wafer processing to North America with Axus Technology

03/21/2012 

Fraunhofer IZM and Fraunhofer CNT will use CMP supplier Axus Technology exclusively to provide advanced 300mm wafer process development and foundry services to North American customers.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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