Packaging

PACKAGING ARTICLES



Surrey NanoSystems commercializing advanced packaging innovations with $7M new funding

03/07/2012 

Surrey NanoSystems raised third-round funding of

AMAT, Singapore's microelectronics institute open 3D semiconductor packaging R&D lab

03/07/2012 

Applied Materials Inc. (AMAT) opened the new Centre of Excellence in Advanced Packaging at Singapore

Henkel underfill boasts high Tg for WLCSP and PoP devices

03/06/2012 

Henkel developed LOCTITE UF3810 underfill for high reliability and ease of rework when applied to next-generation wafer-level chipscale packages (WLCSP) and package-on-package (PoP) devices.

Package and micro-mechanical test equipment installed at DfR Solutions

03/06/2012 

DfR Solutions installed micro testing tools from XYZTEC for JEDEC qualification, dynamic bend testing, copper wire bond pull and shear testing, and material characterization of lead-free solders.

STATS ChipPAC brings FOWLP to stacked packages for <1mm profile

03/06/2012 

STATS ChipPAC Ltd. (SGX-ST:STATSChP) uncrated its next-generation eWLB package-on-package (PoP) technology, with a package profile height below 1.0mm.

Flip chip bumping, WLP partnership unites FCI and NANIUM

03/06/2012 

"Together, FCI and NANIUM offer a complete WLP service portfolio covering 150, 200 and 300mm wafer sizes," summarized Armando Tavares, NANIUM president of Executive Board.

Plessey Semiconductors debuts ECG sensor from passive component project

03/05/2012 

Plessey Semiconductors developed the Electric Potential Integrated Circuit (EPIC) sensor, optimized for use as an ECG sensor, at a reportedly lower cost and better resolution than conventional electrodes. It enables ECG monitoring in mobile phone applications.

Multitest test contactor suits large-array, high-pin-count digital chip test

03/02/2012 

Multitest launched a new Quad Tech contactor, the Triton contactor, for high-end digital test applications such as server, computer, mobile smartphone, digital TV, and graphics chips.

HB-LED grade aluminum nitride (AlN) sintering

03/02/2012 

Part 2 of this series covers furnace considerations for a new HB-LED-grade AlN, as well as furnace throughput. Jonathan Harris, CMC Laboratories, covers the role of the oxide sintering phase in AlN in defining the materials microstructure and thus determining key properties such as thermal conductivity and mechanical strength.

Elpida begins reorganization in Tokyo court: Analysts weigh in

03/02/2012 

Elpida Memory Inc. (Tokyo: 6665) resolved to file a petition for the commencement of corporate reorganization proceedings, and filed the same with the Tokyo District Court. Akita Elpida Memory Inc. also saw the commencement of corporate reorganization proceedings

WACKER opens silicone R&D center for Korean electronics makers

03/02/2012 

WACKER expanded and relocated its South Korea technical laboratories and offices, bringing together R&D operations, applications technology, and basic and advanced training in silicones and polymers applications.

AMAT, A*STAR Advanced Packaging Centre of Excellence plans grand opening

03/01/2012 

Applied Materials and Singapore's A*STAR Institute of Microelectronics will officially open the Centre of Excellence in Advanced Packaging, in Singapore

Thermal modeling software aids 3D IC, SoC, SiP designs

03/01/2012 

Docea Power, power and thermal analysis software supplier, released AceThermalModeler for generating compact thermal models of SoCs, 3D ICs, SiP devices, and complete boards.

DuPont sells CMP JV interests to Air Products

03/01/2012 

Air Products will acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), a 50-50 JV that the companies set up for the semiconductor and wafer polishing industries.

Two-element wafer-level camera from Nemotek boasts low distortion

02/28/2012 

Nemotek Technologie uncrated a two-element wafer-level camera, Exiguus H12-A2. The two-element lense gives Exiguus H12-A2 high resolution and low (<0.5%) distortion.

HB-LED grade aluminum nitride meets thermal needs of today's LEDs

02/24/2012 

In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.

LED packaging report reveals costs, reliability impact of package

02/24/2012 

With thermal issues accounting for half of all lighting failures, and costs prohibitive to widespread adoption, assembly and packaging are keys to improving LEDs. TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency.

SEMICON China: Challenges and opportunities for semiconductors, emerging techs

02/23/2012 

SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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