12/05/2017  Discovery expected to lower energy consumption in electric power equipment.

12/05/2017  Quarterly billings of US$14.3 billion set an all-time record for quarterly billings, exceeding the record level set in the second quarter of this year.

12/01/2017  Electronics manufacturing executives will attend Europe’s SEMI Industry Strategy Symposium (ISS Europe) in Dublin, Ireland on 4-6 March.

12/01/2017  The ConFab 2018, to be held at The Cosmopolitan of Las Vegas on May 21-23, is thrilled to announce the newest opening day Keynote speaker, Professor John M. Martinis.

11/30/2017  The semiconductor industry continued its upward trend in the third quarter of 2017, notching 12 percent sequential growth with strength across all application markets, according to IHS Markit.

11/30/2017  Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, today announced the latest generation of silicon-on-insulator (SOI) substrates in its Imager-SOI product line designed specifically for fabricating front-side imagers for near-infrared (NIR) applications including advanced 3D image sensors.

11/29/2017  Semiconductor test equipment supplier Advantest Corporation has developed the M4171 handler to meet the mobile electronics market's needs for cost-efficient thermal control testing of ICs with high power dissipation during device characterization and pre-production bring up.

11/17/2017  Cadence Design Systems, Inc. today announced that Anirudh Devgan, executive vice president and general manager of the Digital & Signoff Group and the System & Verification Group, has been appointed president of Cadence, effective immediately.

11/17/2017  Broadcom Limited, a semiconductor device supplier to the wired, wireless, enterprise storage, and industrial end markets, today announced that it has completed its acquisition of Brocade Communications Systems, Inc.

11/17/2017  Crosstalk and noise can become a major source of reliability problems of CNT based VLSI interconnects in the near future.

11/16/2017  Quality Intelligence solution enables chip metallization provider to improve accuracy and timeliness of data capture, rapidly respond to issues, and identify opportunities for continuous improvement.

11/16/2017  SkyWater Technology Foundry announces that it has been assigned the Specialty Foundry customer relationships from Cypress Semiconductor Corporation.

11/15/2017  SEMICON Southeast Asia 2018 to bolster growing semiconductor industry in the region.

11/15/2017  The company’s $26 billion in 2017 outlays expected to be more than Intel and TSMC combined.

11/14/2017  Semiconductor industry back on track for growth in Europe -- major new investments.

11/13/2017  New pitch record in copper hybrid bonding with outstanding wafer-to-wafer overlay accuracy represents a breakthrough in enabling 3D high-density IC applications.

11/09/2017  Alpha and Omega Semiconductor Limited today announced the release of AONS66916 production utilizing the latest Alpha Shield Gate Technology Generation 2 (AlphaSGT2).

11/09/2017  IC Market Drivers 2018 report ranks major end-use applications and their impact on IC market growth.

11/08/2017  A*STAR’s Institute of Microelectronics (IME) has established a development line to accelerate the development of fan-out wafer level packaging (FOWLP) capabilities for next-generation Internet of Things (IoT) technologies.

11/08/2017  Earlier this year, DARPA's Microsystems Technology Office (MTO) announced a new Electronics Resurgence Initiative (ERI) "to open pathways for far-reaching improvements in electronics performance well beyond the limits of traditional scaling."