Packaging

PACKAGING ARTICLES



ArterisIP joins GLOBALFOUNDRIES FDXcelerator Partner Program

10/13/2017  ArterisIP, the supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the FDXcelerator Partner Program.

Leti to present update of CoolCube/3D VLSI tech developments at 2017 IEEE S3S

10/13/2017  Leti, a research institute of CEA Tech, will hold a workshop on Oct. 17 to present updates on their progress developing CoolCube high-density 3D sequential, monolithic-integration technology, and their supporting design-and-manufacturing ecosystems.

IC makers maximize 300mm, 200mm wafer capacity

10/13/2017  A total of 25 new 300mm wafer fabs is expected between 2016 and 2021 as the outlook for 450mm wafers fades.

A 1,000x improvement in computer systems using current fabs and process

10/12/2017  Next week, as part of the IEEE S3S 2017 program, MonolithIC 3D Inc. will present a paper (18.3) titled “A 1,000x Improvement in Computer Systems by Bridging the Processor Memory Gap”.

Intel delivers 17-qubit superconducting chip with advanced packaging to QuTech

10/12/2017  The new chip was fabricated by Intel and features a unique design to achieve improved yield and performance.

Toshiba Memory Corp to invest in production equipment for Fab 6 at Yokkaichi operations

10/11/2017  TMC will invest approximately 110 billion yen as a second investment in Fab 6 for the installation of additional manufacturing equipment in the Phase-1 clean room.

Seeing the next dimension of computer chips

10/11/2017  Researchers image perfectly smooth side-surfaces of 3-D silicon crystals with a scanning tunneling microscope, paving the way for smaller and faster computing devices.

CMOS image sensor market to witness growth owing to high adoption of innovative technologies

10/10/2017  The global CMOS image sensor market is expected to grow at a CAGR of more than 12% during the forecast period, according to Technavio’s latest market research.

Gartner identifies the top 10 strategic technology trends for 2018

10/06/2017  Gartner, Inc. this week highlighted the top strategic technology trends that will impact most organizations in 2018.

Nordson launches Corporate Responsibility and Sustainability Report

10/06/2017  The report enhances transparency in the environmental, social and governance (ESG) areas determined to be most material to the company and its stakeholders.

Columbia engineers invent breakthrough millimeter-wave circulator IC

10/06/2017  Researchers are first to demonstrate a circulator on a silicon chip at mm-wave frequencies that enables nonreciprocal transmission of waves: device could enable two-way radios and transform 5g networks, self-driving cars, and virtual reality.

Power semiconductor sales rebounded in 2016 and will continue to grow through 2021

10/05/2017  Global power semiconductor revenues grew year-over-year by 3.9 percent in 2016, reversing a 4.8 percent decline in 2015.

Pure-play foundries boosting their presence in China

10/05/2017  With fabless companies in China on the rise, the country is expected to account for 13% share of pure-play foundry sales in 2017.

Monthly semiconductor sales reach $35B globally for first time in August

10/04/2017  Worldwide sales up 24 percent year-to-year and 4 percent month-to-month; Americas market leads the way with growth of 39 percent year-to-year and 9 percent month-to month.

Team builds flexible new platform for high-performance electronics

10/04/2017  A team of University of Wisconsin–Madison engineers has created the most functional flexible transistor in the world -- and with it, a fast, simple and inexpensive fabrication process that’s easily scalable to the commercial level.

Unprecedented opportunities in automotive electronics

10/03/2017  Workshop will highlight rapid advancements in automotive electronics technologies and applications, and explore technical and business barriers and opportunities that are best addressed collectively across the supply chain.

Comparing XPoint memory architecture with NAND and DRAM products

10/03/2017  There has been a great deal of speculation around the composition of Intel’s Optane XPoint memory technology. TechInsights set about to find answers.

Comet Group to open Silicon Valley office

10/03/2017  COMET Group today announced the opening of Lab One, its customer-centric technology and application center in San Jose, CA.

Robotics and chip industries in Japan

10/02/2017  Japan chip industry finds growth opportunities in robotics; explored at SEMICON Japan (December 13-15) in Tokyo.

New 3D packaging & integration committee

10/02/2017  The SEMI International Standards Committee, at their SEMICON West 2017 meeting, approved the transformation of the existing 3D Stacked IC Committee and Assembly & Packaging Committee into a single, unified 3D Packaging and Integration Committee.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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