09/29/2017  Jointly developed 14HP process is world’s only technology that leverages both FinFET and SOI.

09/28/2017  SK Hynix Inc. announced its board of directors yesterday approved its plan to participate in a Bain Capital-led consortium that plans to purchase Toshiba Corporation's memory chip unit, Toshiba Memory Corporation

09/27/2017  Inventory corrections, economic uncertainty, and price erosion derailed the power transistor market in the last five years, but the 2017 O-S-D Report sees steady modest growth ahead.

09/26/2017  Last year was a great year for photovoltaic (PV) technology.

09/25/2017  Cypress Semiconductor Corp. today announced the appointment of Jeffrey J. Owens to its board of directors.

09/25/2017  Synopsys, Inc. today announced that the Synopsys Design Platform has been fully certified for use on Samsung Foundry's 28FDS (FD-SOI) process technology.

09/22/2017  The basics of laser marking are reviewed, as well as current and emerging laser technologies.

09/22/2017  Equipment billings in August declined relative to July, signaling a pause in this year's extraordinary growth.

09/20/2017  New programs on Materials, Automotive, and Flexible Electronics expand SEMICON Europa's impact.

09/20/2017  Sales of ICs built using <40nm process technology forecast to rise 18% at pure-play foundries.

09/19/2017  Learn all about Monolithic 3D at IEEE S3S.

09/18/2017  GLOBALFOUNDRIES today announced the availability of a new set of enhanced RF SOI process design kits (PDKs) to help designers improve their designs of RF switches and deliver differentiated RF front-end solutions for a wide range of markets including front-end modules for mobile devices, mmWave, 5G and other high-frequency applications.

09/18/2017  Decades ago, the Moore's law predicted that the number of transistors in a dense integrated circuit doubles approximately every two years. This prediction was proved to be right in the past few decades, and the quest for ever smaller and more efficient semiconductor devices have been a driving force in breakthroughs in the technology.

09/15/2017  Researchers and exhibitors will showcase their work during a comprehensive conference program of technical papers, panels, special sessions, short courses/tutorials, and an exhibition that will spotlight premier work in the fields of microelectronics, semiconductor packaging and circuit design.

09/15/2017  Cadence Design Systems, Inc. today announced that John Wall, corporate vice president of finance and corporate controller of Cadence, has been appointed senior vice president and chief financial officer of Cadence, effective October 1, 2017.

09/15/2017  Flex Logix Technologies, Inc., a supplier of embedded FPGA IP and software, today announced it has won the TSMC Open Innovation Platform's Partner of the Year Award 2017 in the category of New IP for its EFLX embedded FPGA IP product.

09/14/2017  Despite a slightly down first quarter, the semiconductor industry achieved near record growth in the second quarter of 2017, posting a 6.1 percent growth from the previous quarter, according to IHS Markit.

09/13/2017  This is the first stage in beginning FD-SOI production in Singapore and providing multi-site FD-SOI substrate sourcing to the global semiconductor market.

09/13/2017  Cadence Design Systems, Inc. today announced new capabilities that complete its holistic, integrated design flow for TSMC's advanced wafer-level Integrated Fan-Out (InFO) packaging technology.

09/12/2017  Upbeat about the growth prospects of Taiwan's electronics sector, more than 45,000 visitors are expected to attend SEMICON Taiwan 2017 which opens tomorrow at Taipei's Nangang Exhibition Center.