09/12/2017  2017 fab equipment spending (new and refurbished) is expected to increase by 37 percent, reaching a new annual spending record of about US$55 billion.

09/06/2017  Slated for September 18-20 in San Jose, Calif., the 18th annual SMC “offers a unique chance to network and discover opportunities in and around the industry in a year where dramatic growth has returned to the semiconductor market,” observes SMC 2017 co-chair Mark Thirsk of Linx Consulting, who will provide opening remarks at the conference.

09/05/2017  Flex Logix Technologies, Inc., the supplier of embedded FPGA IP and software, today announced that it has joined the TSMC IP Alliance Program included in TSMC's Open Innovation Platform.

09/05/2017  STMicroelectronics (NYSE: STM) has announced the integration of its contactless NFC technology with MediaTek's mobile platforms.

09/01/2017  There have been media reports speculating that Toshiba will make a decision on Aug 31 at Toshiba’s Board of Directors meeting.

09/01/2017  A dozen performer teams with DARPA’s CHIPS program convene to kick off an ambitious push for an era of versatile, plug-and-play "chiplets."

09/01/2017  How is the IGBT market evolving for different applications? How will the IGBT market face the adoption of high performance WBG based devices?

09/01/2017  It has been nearly a decade since Toshiba announced the use of backside TSV’s to miniaturize CMOS image sensors.

09/01/2017  In 2018, 7.7 percent growth is expected, resulting in another record-breaking year—totaling $53.2 billion for the global semiconductor equipment market.

08/31/2017  Spending for DRAM expected to show biggest percentage gain in 2017.

08/28/2017  The ConFab – an exclusive conference and networking event for semiconductor manufacturing and design executives from leading device makers, OEMs, OSATs, fabs, suppliers and fabless/design companies – announces the 2018 event will be held at THE COSMOPOLITAN of LAS VEGAS on May 20-23.

08/22/2017  LTX-Credence shipped the 600th PAx test system to Skyworks Solutions, Inc.

08/22/2017  MRSI Systems is launching a new High Speed Die Bonder, MRSI-HVM3, to support photonics customers’ high volume manufacturing requirements.

08/22/2017  Samsung remains the “wild card” with regard to 2H17 capital expenditures.

08/21/2017  TowerJazz to gain up to 50% of the planned fab loading capacity.

08/18/2017  Global DRAM revenue reached a new historical high in the second quarter of 2017, according to DRAMeXchange.

08/16/2017  Chipmakers want every part of the wafer to yield good die. Advances in process technologies have just about made this a reality, even as feature dimensions continue to shrink and devices grow more complex.

08/15/2017  Topping the chart of fastest-growing products is DRAM, which comes as no surprise given the strong rise of average selling prices in this segment throughout the first half of 2017.

08/15/2017  The global semiconductor advanced packaging market is expected to grow at a CAGR of 8.45% during the period 2017-2021, according to Research and Markets.

08/14/2017  The increase in vacuum process intensity of the semiconductor industry means that by 2022, the market for vacuum subsystems could be up to 62 percent higher than today’s value of $1.9 billion.