11/03/2016  Lattice Semiconductor Corporation and Canyon Bridge Capital Partners, Inc. today announced that Lattice and Canyon Bridge Acquisition Company, Inc., an affiliate of Canyon Bridge, have signed a definitive agreement under which Canyon Bridge will acquire all outstanding shares of Lattice for approximately $1.3 billion.

11/03/2016  Leti, an institute of CEA Tech, and PYXALIS, a French SME specializing in high-performance image sensors, today announced a new technology that lowers readout noise for image sensors down to 0.5 electron noise and dramatically improves low-light image sensing capabilities.

11/02/2016  In 2015, more than US$1 billion was invested in China’s advanced packaging ecosystem, announces Yole in its report Status and Prospects for the Advanced Packaging Industry.

11/01/2016  Investments in its facilities will enhance current System LSI production to meet the growing demands in the industry for advanced system-on-chip (SoC) products especially for mobile and other electronic devices.

10/30/2016  The 62nd annual IEDM will be held in San Francisco December 3 - 7, 2016.

10/30/2016  Lam talks about process control and default roadmaps.

10/30/2016  Toshiba was the first to commercially implement CMOS image sensors with backside TSV last technologies in 2007. Many of us stated in 2007 that further advances could be obtained by removing the CMOS circuitry to a separate layer and forming a true 3D chip stack, but the technology imple- mentation had to wait while the industry first converted to back side imaging technology.

10/30/2016  I’m delighted to announce that The ConFab, our premier semiconductor manufacturing conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017. For more than 12 years, The ConFab, an invitation-only executive conference, has been the destination for key industry influencers and decision-makers to connect and collab- orate on critical issues.

10/25/2016  Synopsys, Inc. today announced that its Custom Compiler tool has been certified by Samsung Electronics Co., Ltd. to support their 10-nanometer (nm) LPP (Low Power Plus) process.

10/24/2016  180nm CMOS and HV-CMOS MPW runs are now manufactured in ams' 200mm fabrication facility in Austria.

10/24/2016  SEMICON Europa co-locating with productronica and electronica, expanding electronics focus.

10/21/2016  A new design for transistors which operate on 'scavenged' energy from their environment could form the basis for devices which function for months or years without a battery, and could be used for wearable or implantable electronics.

10/21/2016  Stanford, Oxford team creates high-efficiency tandem cells.

10/20/2016  Avalanche Technology, Inc., has entered into a manufacturing agreement with Sony Semiconductor Manufacturing Corporation to begin production of it's Spin Transfer Torque Magnetic RAM (STT-MRAM) on 300mm wafers at various advanced geometry nodes.

10/19/2016  Rebound in DRAM market helps raise outlook for total IC market.

10/19/2016  SEMI Korea has hosted a SEMI member event every year for its members since 2008 to provide networking opportunities and insight on the ever-changing issues in the industry.

10/18/2016  The HSA Foundation has expanded its Academic Partnership Program with the addition of Northeastern University as the first HSA Academic Center of Excellence.

10/17/2016  Samsung Electronics Co., Ltd. today announced that it has commenced mass production of System-on-Chip (SoC) products with 10-nanometer (nm) FinFET technology for which would make it first in the industry.

10/17/2016  A new type of atomic force microscope (AFM) uses nanowires as tiny sensors. Unlike standard AFM, the device with a nanowire sensor enables measurements of both the size and direction of forces. Physicists at the University of Basel and at the EPF Lausanne have described these results in the recent issue of Nature Nanotechnology.

10/17/2016  Russian and Japanese scientists demonstrate that compact coherent plasmon sources based on van der Waals heterostructures can be designed for use in optoelectronics.