07/21/2016  Contributing editor and blogger Phil Garrou received the 3D InCites "Device of the Year" award during the 2016 SEMICON West conference for "Excellence in 3D Packaging Technologies."

07/20/2016  Amkor Technology, Inc. recently received the 3D InCites "Device of the Year" award during SEMICON West for its' SWIFT semiconductor package.

07/19/2016  The semiconductor industry is moving quickly to adopt a variety of new materials in an effort to increase chip performance.

07/15/2016  Toshiba Corporation and Western Digital Corporation today celebrated the opening of the New Fab 2 semiconductor fabrication facility located in Yokkaichi, Mie Prefecture, Japan.

07/15/2016  At the ECTC conference in May, in the “Advances in Fan Out Packaging” session, Matt Lueck of RTI International discussed the results of their joint program with X-Celeprint.

07/14/2016  Cellphone IC market CAGR to exceed total IC market CAGR by 3.0 points through forecast.

07/13/2016  Fan-out wafer level packaging (FOWLP) is gaining traction, leading to higher I/Os and larger formats, and new mobile displays are pushing the limits of pixel per inch (PPI) while also moving to larger formats.

07/13/2016  Leti, an institute of CEA Tech, and the Korea Institute of Science and Technology (KIST) today announced an agreement to jointly explore a variety of technologies, including monolithic 3D, neuromorphic architectures, non-volatile 3D memory, spintronics and ultra-low power semiconductors.

07/13/2016  Gear up for Day 2 of SEMICON West with this list of must-see conference events.

07/13/2016  Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.

07/13/2016  Cisco VP urges conference goers to invest in digitized supply chains to stay relevant.

07/12/2016  Leti, a CEA Tech institute, today announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy efficient than current solutions and is compatible with 3D architectures.?

07/12/2016  SEMI projects that the worldwide semiconductor equipment market will be flat this year and will rebound in 2017 according to the mid-year edition of the SEMI Capital Equipment Forecast, released today at the SEMICON West exposition.

07/12/2016  The near-term outlook for semiconductor manufacturing is challenging, with revenues down slightly but equipment spending up a bit, as reported by experts during the SEMI/Gartner Market Symposium held yesterday afternoon.

07/11/2016  Clearfind technology sees organic defects that often escape detection with conventional white-light inspection technologies.

07/11/2016  AppliedMicro's innovative silicon products enabled by TSMC's advanced technology.

07/11/2016  EV Group (EVG) today introduced the EVG50 automated metrology system.

07/11/2016  Applied Materials, Inc. today announced its next-generation e-beam inspection system is delivering the highest resolution and image quality at the fastest throughput to leading foundry, logic, DRAM and 3D NAND customers as they move to advanced nodes.

07/08/2016  Photoresist manufacturers had reason to smile as fiscal 2015 closed, with sales growing nicely to $1.37B, a 6.2% increase over 2014.

07/08/2016  Weak global economy and poor DRAM market to drag down growth this year.