02/12/2016  At next week’s SPIE Photonics West 2016, imec will demonstrate a lens-free microscope for large field-of-view live imaging at micrometer resolution.

02/12/2016  University of Washington scientists have successfully combined two different ultra thin semiconductors to make a new two-dimensional heterostructure with potential uses in clean energy and optically-active electronics.

02/11/2016  EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies.

02/11/2016  SEMI, the global industry association serving the nano- and micro-electronic manufacturing supply chains, will once again be hosting SEMICON Southeast Asia.

02/11/2016  The FinFET technology market is expected to grow from $4.91 billion USD in 2015 to $35.12 billion by 2022, at a compound annual growth rate (CAGR) of 26.2% between 2016 and 2022.

02/11/2016  Teradyne, Inc. has appointed Gregory Smith as president of the Teradyne semiconductor test division, replacing Mark Jagiela who has been acting division president since 2014.

02/10/2016  SEMI announced today the launch of the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group.

02/10/2016  Worldwide silicon wafer area shipments increased 3 percent in 2015 when compared to 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

02/10/2016  Orbotech Ltd. today announced that, Nippon Mektron Mektec, a maker of flexible printed circuit boards (FPCBs), is deploying Orbotech direct imaging (DI) and automated optical inspection (AOI) systems in multiple factories.

02/09/2016  As of December 2015, roughly half of the world’s total IC wafer production capacity was located in seismically active areas.

02/09/2016  How Texas Instruments got greener, safer and saved money.

02/08/2016  SEMICON Russia 2016 on 7-9 June will provide insights into market developments, technology, and business opportunities, short and long-term.

02/08/2016  A new 5D solution utilizes multiple types of metrology systems to identify and control fab-wide sources of pattern variation, with an intelligent analysis system to handle the data being generated.

02/08/2016  TSMC this weekend announced that the earthquake of 6.4 magnitude which struck southern Taiwan at 3:57 am on February 6, 2016 did not cause any serious personnel injuries nor any structural or facility damage to the Company’s Fab 14 and Fab 6 manufacturing sites in the Tainan Science Park.

02/08/2016  A research team at the Department of Electrical and Electronic Information Engineering at Toyohashi University of Technology has developed a wafer-level packaging technique to integrate a silicon large-scale integration (LSI) chip in a very thin film of a thickness 10 ?m.

02/05/2016  Taiwan's Investment Commission on Wednesday gave Taiwan Semiconductor Manufacturing Co. (TSMC) approval to build its first 12-inch wafer fab in mainland China.

02/05/2016  When will the panel industry take off? How will it evolve?

02/05/2016  A brief recap of China market news for January 2016.

02/04/2016  The health of the IC industry is increasingly tied to the health of the worldwide economy. Rarely can there be strong IC market growth without at least a “good” worldwide economy to support it.

02/02/2016  Presto Engineering Inc. announced this week that it has significantly expanded its turnkey capabilities with the opening of two new manufacturing hubs and a world-wide logistics center in Asia.