Packaging

PACKAGING ARTICLES



Advanced packaging industry: What's new on the market?

01/13/2016  The mobile sector is driving production and market growth; however a new market driver, IoT is on the horizon and is expected to have a significant impact on the advanced packaging industry.

Growth and a changing ecosystem at SEMI ISS 2016

01/13/2016  The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme ?Integrating for Growth: Markets, Technology, Ecosystem.? The packed conference of C-level executives gave the year?s first strategic outlook of the global electronics manufacturing industry.

GLOBALFOUNDRIES engineers receive international recognition

01/12/2016  Two GLOBALFOUNDRIES engineers, one in New York and one in Vermont, have been designated as IEEE Fellows by the Institute of Electrical and Electronics Engineers.

Semiconductor capital spending to decline 4.7% in 2016, according to Gartner

01/12/2016  Worldwide semiconductor capital spending is projected to decline 4.7 percent in 2016, to $59.4 billion, according to Gartner, Inc.

Semiconductor capital spending market in the US to reach over $31B by 2019

01/11/2016  Technavio's market research analysts estimate the semiconductor capital spending market in the US, to grow at a CAGR of around 9% between 2015 and 2019.

Flash, STT-MRAM and resistive RAM: They all come with different challenges

01/11/2016  Research in memory is really exciting these days: in parallel you have the scaling of classical memories (SRAM, DRAM, Flash) and the emergence of new memories capable of enabling new applications or even new system hierarchies. At imec, we mostly focus on three concepts which all come with different challenges.

Viewpoints: 2016 outlook

01/11/2016  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2016.

Worldwide semiconductor revenue declined 1.9% in 2015, Gartner reports

01/08/2016  Worldwide semiconductor revenue totaled $333.7 billion in 2015, a 1.9 percent decrease from 2014 revenue of $340.3 billion, according to preliminary results by Gartner, Inc.

Samsung, TSMC remain tops in available wafer fab capacity

01/07/2016  GlobalFoundries, TSMC, SK Hynix show greatest gains in wafer capacity in 2015.

A wild ride in 2015 - and two steps forward in 2016

01/07/2016  “In like a lion, out like a lamb” is just half the story for 2015. While initial expectations forecasted a double-digit growth year, the world economy faded and dragged our industry down to nearly flat 2015/2014 results.

Global semiconductor sales dip slightly in November

01/05/2016  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $28.9 billion for the month of November 2015.

Rudolph Technologies receives order for multiple NSX 330 Systems in Asia

01/05/2016  Rudolph Technologies, Inc., has received an order for over $15 million from a foundry in Asia for multiple NSX 330 Systems.

Belle Wei appointed to SEMI Foundation board of trustees

01/05/2016  The SEMI Foundation today announced that Belle W. Y. Wei, Ph.D., was elected as a new director to the SEMI Foundation Board of Trustees in accordance with the association's by-laws.

A Year in Review: A look back at the top stories from 2015

01/04/2016  2015 was a year of unprecedented consolidation in the semiconductor industry, as well as a technological crossroads in Moore’s Law. Below is a round-up, based on reader popularity, of the most read stories on Solid State Technology from 2015.

Koyanagi and Ramm win 3DIC Pioneering Award

12/21/2015  At the 12th annual 3D ASIP [Architectures for Semiconductor Interconnect and Packaging] Conference, sponsored by RTI Int, in Redwood City CA last week, Professor Mitsumasa Koyanagi of Tohoku University and Dr. Peter Ramm of Fraunhofer EMFT were the conference's first recipients of the “3DIC Pioneer Award”.

North American semiconductor equipment industry posts November 2015 book-to-bill ratio of 0.96

12/18/2015  North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2015 (three-month average basis) and a book-to-bill ratio of 0.96.

SPTS Technologies installs a 300mm MEMS vapor HF etch release solution at CEA-Leti

12/18/2015  SPTS Technologies has supplied CEA-Leti, one of Europe’s largest micro- and nanotechnologies research institutes, with its vapor HF etch release systems for 300mm microelectromechanical systems (MEMS) on CMOS development.

Internet of Things market to nearly double by 2019

12/17/2015  Between 2015 and 2019, worldwide systems revenues for applications connecting to the Internet of Things will nearly double, reaching $124.5 billion in the final year of this decade, according to IC Insights’ new 2016 edition of its IC Market Drivers report. During that same timeframe, new connections to the Internet of Things (IoT) will grow from about 1.7 billion in 2015 to nearly 3.1 billion in 2019 (Figure 1), based on the forecast in the new 450-page report, which examines emerging and major end-use applications fueling demand for ICs.

Advanced semiconductor packaging drives materials consumption through 2019

12/15/2015  The $18 billion semiconductor packaging materials will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC leadframes, underfill, and copper wire.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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