07/23/2015  After two Semiconductor Strategy Symposiums in Ho Chi Minh City in 2013 and 2014, SEMI announced today that a SEMI Member Delegation will visit the Vietnamese Central Government in Hanoi on September 21-24.

07/23/2015  ROHM Co., Ltd., a developer of analog power IC solutions, announced today that it has completed the acquisition of Powervation Ltd., a privately held digital power IC company that develops Digital Power Management system-on-chip (SoC) solutions.

07/22/2015  SIA recognized members of the caucus at a reception on Capitol Hill Tuesday evening and honored the caucus's co-chairs, Sen. James Risch (R-Idaho), Sen. Angus King (I-Maine), Rep. Pete Sessions (R-Texas), and Rep. Zoe Lofgren (D-Calif.).

07/22/2015  SEMI today announced the fourth annual European 3D Summit. Entitled ?European 3D Summit 2016: Above and Beyond TSV,? the advanced semiconductor Summit will take place on January 18-20, 2016 in Minatec in Grenoble, France.

07/21/2015  Solid State Technology today announced that Dr. Gary Patton has joined the Advisory Board for its annual conference and networking event, The ConFab.

07/21/2015  Amkor Technology, Inc. today announced plans to expand its assembly and test factory located in China’s Shanghai Waigaoqiao Free Trade Zone.

07/16/2015  Semiconductor test equipment and inspection/metrology equipment are unglamorous yet critical segments of the equipment field.

07/16/2015  Wafer bumping has several advantages over traditional wire bonding. Bumps can be placed almost anywhere on the die, where wire bonding is limited to the periphery of the devices. And bumps give you the ability to put many more I/O points on an individual die.

07/15/2015  SEMI honored six industry leaders for their outstanding accomplishments in developing Standards for the microelectronics and related industries.

07/15/2015  “Let no element on the periodic table go un-used!” That may well be the rallying cry of the semiconductor industry moving forward.

07/14/2015  SEMICON West 2015 kicked off Tuesday morning with a keynote panel session that addressed the challenges of "Scaling the Walls of Sub-14nm Manufacturing."

07/14/2015  SEMI today announced that Stephen S. Schwartz, CEO of Brooks Automation, and Toshikazu Umatate, senior vice president and general manager of the Semiconductor Lithography Business at Nikon Corporation, were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

07/14/2015  China’s state-owned Tsinghua Unigroup Ltd. is preparing a $23 billion bid for chipmaker Micron Technology, in what analysts say would be the biggest Chinese takeover of a U.S. company.

07/14/2015  The expansion of fan-out is finally coming, says Rich Rogoff, Vice President and General Manager, Lithography Systems Group at Rudolph Technologies.

07/14/2015  The used and refurbished semiconductor equipment market can be a hazardous business for buyers. The watchword always is: Caveat emptor – let the buyer beware.

07/14/2015  SEMI projects three consecutive years of growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEMI Capital Equipment Forecast, released today at the SEMICON West exposition.

07/14/2015  At this year’s Design Automation Conference (DAC) in San Francisco, Brian Otis, a Director at Google, talked about how hundreds of millions of people are at risk of diabetes – and how a smart contact lens that continuously monitors blood glucose levels and transmits the data to a smartphone might just be the ideal solution.

07/14/2015  The demand for 4-mask layer Cu-plated wafer-level chip scale packaging (WLCSP) is increasing rapidly, and the current capability for in-line Cu height measurements is not suitable for high volume manufacturing (HVM).

07/13/2015  The era of three-dimensional chips is upon us.

07/13/2015  Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing.