Packaging

PACKAGING ARTICLES



ISSI agrees to merger terms with Cypress Semiconductor

06/10/2015  Integrated Silicon Solution, Inc. today announced that it has finalized a definitive agreement to be acquired by Cypress Semiconductor Corporation for $20.25 per share in cash.

FOWLP and embedded packaging

06/10/2015  At the recent IMAPS conference, Yole’s Jerome Alzemer updated the audience on the Fan Out and Embedded die marketplace, based on his new report “Fan out and Embedded Die: Technology and Market Trends.”

Drive profitability through better forecasting

06/10/2015  Different forecasting algorithms are highlighted and a framework is provided on how best to estimate product demand using a combination of qualitative and quantitative approaches.

Three trends driving optoelectronics market growth through 2019

06/09/2015  Laser transmitters, CMOS image sensors, and high-brightness LEDs will be key to expansion.

SEMI reports first quarter 2015 worldwide semiconductor equipment figures; billings $9.52B

06/09/2015  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$9.52 billion in the first quarter of 2015.

50 Years of Moore’s Law

06/09/2015  For 50 years, Moore’s Law has served as a guide for technologists everywhere in the world, setting the pace for the semiconductor industry’s innovation cycle.

Move over, 16nm – here comes 10nm chips

06/08/2015  Taiwan Semiconductor Manufacturing wants you to know that they’re ready, willing, and able to help you design chips with 10-nanometer features.

Leti launches new Silicon Impulse FD-SOI Development Program

06/08/2015  CEA-Leti announced today during the Design Automation Conference that seven partners have joined its new FD-SOI IC development program, Silicon Impulse.

A novel characterization technique unveils the 3D structure of conductive filaments in resistive switching memories

06/05/2015  Imec researchers have developed a novel technique – termed conductive atomic force microscopy tomography (or scalpel C-AFM) – that enables a three-dimensional characterization of emerging logic and memory devices.

Reduced defectivity and cost of ownership copper CMP cleans

06/05/2015  A new, low pH, BTA free, noble-bond chemistry produced equivalent yield at substantially lower costs.

Fab equipment growth continues into 2015

06/04/2015  Fab equipment spending is forecast to depart from the typical historic trend over the past 15 years of two years of spending growth followed by one of decline. For the first time, equipment spending could grow every year for three years in a row: 2014, 2015, and 2016.

Global semiconductor sales increase in April; Steady growth projected

06/03/2015  The Semiconductor Industry Association (SIA) announced worldwide sales of semiconductors reached $27.6 billion for the month of April 2015, 4.8 percent higher than the April 2014 total of $26.3 billion and 0.4 percent lower than last month's total of $27.7 billion.

Avago Technologies acquisition of Broadcom creates new semiconductor powerhouse

06/02/2015  Merger activity in the semiconductor industry moved to a new level with the announcement of the agreement for Avago Technologies to acquire Broadcom.

GLOBALFOUNDRIES solidifies 14nm finFET design infrastructure for next-generation chip design

06/02/2015  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced it has reached a critical milestone in providing a design infrastructure for its 14-nanometer (nm) FinFET process technology.

Fan-in WLP manufacturing capacities are full and more volume is required

05/29/2015  The semiconductor industry is facing a new era in which device scaling and cost reduction will not continue on the path they followed for the past few decades, with Moore’s law in its foundation.

Diverse packaging and test issues up for debate at SEMICON West 2015

05/29/2015  SEMI this week announced the SEMICON West 2015 test and packaging program agendas.

Tablet shipments lose momentum; Total PC unit forecast downgraded

05/29/2015  IC Insights has downgraded its forecast for the overall personal computing market, including much lower growth in tablets and continued weakness in standard PCs.

NXP and Stora Enso to develop intelligent packaging solutions

05/29/2015  NXP Semiconductors and Stora Enso have entered into joint development of intelligent packaging solutions.

Collaboration could lead to biodegradable computer chips

05/29/2015  Portable electronics - typically made of non-renewable, non-biodegradable and potentially toxic materials - are discarded at an alarming rate in consumers' pursuit of the next best electronic gadget.

UMC unveils UMC Auto Platform to enable automotive IC designs

05/26/2015  United Microelectronics Corporation, a global semiconductor foundry, today unveiled its UMC Auto technology platform to target IC companies designing chips for automotive applications.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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