07/31/2018  Correlation coefficient expected to reach a very high level of 0.95 in the 2018-2022 timeframe.

07/30/2018  Imec, a research and innovation hub in nanoelectronics and digital technologies, announces that Niels Verellen, one of its young scientists, has been awarded an ERC Starting Grant.

07/26/2018  The VCSEL industry took a strategic turn last year with the release of the latest iPhone. Indeed the leading smartphones manufacturer, Apple revealed to the entire world a new smartphone with innovative 3D sensing function based on VCSEL technology.

07/26/2018  In a key move to inspire the next generation of innovators, the School District of Osceola County (SDOC) today became the first school district to join the SEMI High Tech U (HTU) Certified Partner Program (CPP), a curriculum that prepares high-school students to pursue careers in STEM fields.

07/26/2018  JUMP program funds 24 new research projects to amplify mission of its six innovation centers.

07/25/2018  TheXcerra MT2168 XT pick-and-place handler was installed for a tri-temp module test application at a major player in global semiconductor manufacturing.

07/25/2018  Global billings of North American equipment manufacturers declined for the current month by 8 percent from the historic high but is still 8 percent higher than billings for the same period last year.

07/24/2018  On its completion in autumn 2019, the facility will be one of the most advanced manufacturing operations in the world, dedicated to production of 3D flash memory.

07/23/2018  Toshiba Memory will start to deliver samples to SSD and SSD controller manufacturers for evaluation from the beginning of September, and expects to start mass production in 2019.

07/20/2018  A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.

07/19/2018  Rahul Goyal of Intel has been elected to a one-year term as board chair of Silicon Integration Initiative, a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

07/18/2018  The board has named Rich Templeton, the company's chairman, to reassume the roles of president and CEO on an ongoing, indefinite basis, in addition to continuing as chairman.

07/18/2018  Amkor Technology, Inc., a provider of outsourced semiconductor packaging and test (OSAT) services, today announced it has partnered with Mentor to release Amkor’s SmartPackage Package Assembly Design Kit (PADK), the first in the industry to support Mentor’s High-Density Advanced Packaging (HDAP) design process and tools.

07/17/2018  Micron and Intel today announced an update to their 3D XPoint joint development partnership, which has resulted in the development of an entirely new class of non-volatile memory with dramatically lower latency and exponentially greater endurance than NAND memory.

07/16/2018  Daniel Cooley has been named Senior Vice President and Chief Strategy Officer.

07/16/2018  Intel is competing to win in the largest-ever addressable market for silicon, which is being driven by the explosion of data and the need to process, analyze, store and share it.

07/16/2018  Boston Semi Equipment (BSE) introduced today its Zeus gravity feed solution for handling pressure MEMS devices that require pressure and vacuum stimulus during testing.

07/13/2018  Broadcom Inc. and CA Technologies today announced that the companies have entered into a definitive agreement under which Broadcom has agreed to acquire CA to build one of the world's leading infrastructure technology companies.

07/13/2018  Bruker Corporation today announced that it has acquired JPK Instruments AG (JPK), located in Berlin, Germany.

07/12/2018  To fulfill the promise of the Internet of Things (IoT), the world needs low-cost high-bandwidth radio-frequency (RF) chips for 5th-generation (5G) internet technology.